The ADIN3310/ADIN6310 Industrial Ethernet Switches are versatile 3-port and 6-port Gigabit Ethernet Time Sensitive Networking (TSN) switches designed for industrial Ethernet applications.
The ADIN3310/ADIN6310 devices support IEEE TSN standards such as 802.1AS (time synchronization), 802.1Qbv (scheduled traffic), and 802.1CB (frame redundancy) to enable reliable, low-latency communication in complex networks. With SGMII and RGMII interfaces, these devices support data rates of up to 1Gbps and include built-in redundancy protocols like HSR and PRP for high availability.
The ADIN3310/ADIN6310 Ethernet switches integrate enhanced security features and can handle VLAN remapping, IGMP snooping, and per-stream filtering. The devices' low power consumption and flexible host interface options (Ethernet or SPI) make them suitable for industrial automation, robotics, and smart building applications.
Key Features and Benefits
- Ethernet MAC interfaces: 10Mb, 100Mb, or 1Gb per port
- 6-port: 4x RMII/RGMII/SGMII and 2x RMII/RGMII
- 3-port: 2x RMII/RGMII/SGMII and 1x RMII/RGMII
- SGMII, 1000BASE-SX/1000BASE-LX/1000BASE-KX, and 100BASE-FX
- Low-latency layer 2 Ethernet switch:
- Deterministic latency from port to port
- Cut-through or store-and-forward operation
- Traffic types and bridge delay per IEEE/IEC 60802
- Standard bridging per IEEE 802.1Q-2018 (tailored)
- Each port is nonblocking and Independent
- 32kB frame buffer per transmit port
- 4096 VLANs
- Time synchronization:
- IEEE 802.1AS-2020
- IEEE 1588-2019 default profile
- IEEE C37.238-2017 energy profile
- 8ns timestamp resolution
- Frames timestamped on ingress or egress
- Custom Layer 2 on two ports for PROFINET IRT, EtherNet/IP beacon-based DLR, and POWERLINK (100Mbp)
- Packet assist engine offloads the host and manages TSN and switch functions
- Portable C drivers for TSN and industrial Ethernet protocols
- Secure boot, secure update with anti-rollback
- Hardware-based cryptography
- Secure host pairing Protocol
- Cryptographic authenticity checking
- Interfaces to the external host processor:
- RMII, RGMII, or SGMII
- SPI, dual SPI, or Quad SPI
- Power:
- 3 external power supplies: 1.1V, 3.3V, and VDDIO_x (1.8V, 2.5V, or 3.3V)
- Total chip power 60mW per port at 1Gbps, full utilization with VDDIO_B = 1.8V
- Package and temperature range:
- 256-ball CSP_BGA, 14mm x 14mm, and 0.8mm pitch
- 196-ball CSP_BGA, 12mm × 12mm, 0.8mm pitch
- Fully specified for -40°C to -85°C and -40°C to 105°C ambient operation
Applications
- Factory and process automation
- Motion control, robots, and cobots
- Energy automation
- Transportation
- Instrumentation
- Building automation
Evaluation Board
The ADIN6310/ADIN3310 can be evaluated with the EVAL-ADIN3310EBZ.
Block Diagrams and Tables
Featured Parts
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