Across the major trends of electrification, autonomous driving, and safety feature development, the automotive industry is expected to exhibit rapid growth, particularly in the applications of high-speed and wireless connectivity. To support the rapid expansion of new and increasingly smaller electronic systems, designers are focusing on miniaturization, thereby seeking new and more compact components and interconnect technologies. This article will introduce the trends in automotive electronics and the micro connectivity solutions offered by Molex.
Automotive electronics demand for reliable, denser, and smaller components
In January 2021, Molex published a survey of 230 qualified decision-makers from automotive OEMs, revealing that 91% of respondents believed the "car of the future" will be fully electric or hybrid. Additionally, 94% of respondents believed it will include autonomous driving features, with high-speed Wi-Fi and wireless charging being among the most desired features. Indeed, safety and driver assistance systems, such as larger displays, camera systems, and LiDAR sensors, are increasingly common across all vehicle models. These trends encourage engineers to integrate features while powering them with denser and smaller components.
Designers typically look for components and interconnect devices commonly found in mobile and consumer electronics as these are normally miniature in size. However, while micro components alleviate space constraints in automotive design, they also need proven reliability for demanding automotive applications. Furthermore, to meet customer expectations, automotive OEMs and their suppliers must adopt electronic components of exceptional quality, including those with a wide temperature range, verified for shock and vibration-acceptance, and compliant with Production Part Approval Processes (PPAP).
As automobiles move towards electrification and smart technology, the number of screens in vehicles is also increasing. As automotive designers incorporate more and larger LCD screens in vehicles, traditional interconnect systems such as wire-to-board connectors are being replaced by compact, fine-pitch Flexible Flat Cables (FFC) and Flexible Printed Circuit (FPC) connectors. These connector systems support higher pin count and frequencies, meeting the demand for higher component densities and better alignment precision. By enabling automated assembly and increasing component density, FPC connector systems also offer economic benefits by freeing up space for new value-added electronic functions.
New-generation vehicles strive for higher levels of safety, leading to an increase in the number of cameras and sensors used. Beyond backup vision, the number of in-vehicles cameras is growing annually. Autonomous and safe driving functions rely on data obtained from cameras and sensors. Many of these cameras and sensors are installed outside the vehicle, requiring components to withstand harsh environments to ensure reliable connections. Designers need to protect sensitive camera connector interfaces exposed to extreme temperatures, vibration, shock, moisture, and contaminants. Since these safety systems cannot afford to fail, protecting the interfaces is critical for system designers. For compact automotive camera systems, robust, sealed and shielded back shells and connector systems are essential.
On the other hand, with the trend towards interconnected homes and workplaces, drivers and passengers have similar expectations for their vehicles. Wireless charging, high-speed data and Wi-Fi are among the features modern car buyers expect. A single USB port is no longer sufficient. With the proliferation of USB Type-C fast charging, consumers expect multiple ports on the dashboard and rear seats to integrate more consumer devices.
Additionally, as cars evolve into mobile computing platforms, more components and PCBs will appear in automotive design. These electronic devices need to withstand vibration and reduce solder joint stress, which can affect performance and lead to module failures. Therefore, modules must be equipped with interconnecting PCBs to ensure the stability and reliability of the modules.
Solutions meeting diverse automotive development needs
Molex has introduced several solutions to address the needs arising from automotive development. For instance, in response to the trend of multi-displays in vehicles, Molex offers the FD19 Easy-On FFC/FPC connectors with 0.50 mm and 1.00 mm pitch. These connectors enhance the performance of vehicle displays and electronic systems with their unique front-flip actuator design and built-in retention features. They can withstand high levels of shock and vibration, and have thermal performance up to 125°C (maximum 150°C). Compliant with automotive-grade LV214 standards, these connectors use a dual-contact terminal design that ensures signal assurance under high shock and high vibration conditions, supporting ZIF connectors and providing wide circuit sizes for maximum design flexibility.
FD19 Easy-On FFC/FPC connectors
For camera applications, Molex provides the FAKRA camera back shell assemblies, which interface with FAKRA connectors and FAKRA cable assemblies. These are customizable for I/O bullet interfaces and mate with custom I/O jacks.
USB Type-C connectors
For popular USB Type-C applications, Molex's USB Type-C connectors can be integrated into dashboard systems, ensuring reliable integration and power-charging of consumer electronics. These connectors support reversible plug orientation and insertion, USB 4 compatibility, up to 5 A of current, high-speed transmission up to 40 Gbps, and are waterproof.
For module interconnect applications, Molex has introduced the SlimStack board-to-board connector system, which can be used to connect PCBs in vehicle modules and systems. These connectors support various floating ranges (in X, Y, and Z directions) even in the mated state, covering the lifespan of the connection. This helps the connector withstand vibration and simplifies assembly. The "floating" feature compensates for tolerance stack-up and supports easy assembly. Molex also has design capabilities to offer custom options tailored to specific needs. For example, the stack height can range from 3.00 mm to over 15.00 mm, with compact sizes and pitch as small as 0.635 mm and 0.40 mm, to support high-speed transmission up to 6 Gbps.
Application of the SlimStack board-to-board connector system
FFC/FPC connectors provide reliable, robust, and user-friendly connector solutions
As many new product designs require a specific number of signal circuits, sourcing small-pitch, multi-circuit FFC/FPC connectors can be challenging. Molex's Easy-On FFC/FPC connectors feature a range of functionalities that enhance design flexibility. These include a wide array of pitch options (from 0.20mm to 2.00mm) and circuit sizes (ranging from 2 to 120), providing electronic manufacturers with reliable, robust, and user-friendly connectors with greater design flexibility. Supported actuator types include front flip, back flip, non-ZIF, slider, flexi-latch, One-Touch designs and more, making them well-suited for consumer, mobile device, and automotive markets.
During assembly, coplanarity issues and multi-step processes can lead to errors and delays. Molex's Easy-On FFC and FPC connectors are highly reliable, robust, and easy to operate, simplifying robotic insertion and fully automated SMT processes. These connectors feature minimal warpage and nickel-plated terminals, and are designed and tested to address coplanarity or other issues that may arise during the SMT process.
Customers need manufacturers who can meet various product compliance requirements and ensure a stable supply chain. As a proven leader in the industry, Molex provides reliable, high-quality products that comply with various environmental standards and RoHS certification. The demands for greater customization and faster fulfillment are driving companies to respond in kind. Availability is as critical as quality, and a reliable partner is now a necessity to navigate the complex global supply chain environment. Molex’s customer-centric approach provides the dynamic, flexible supply chain solutions necessary to support evolving customer needs.
Molex's Easy-On FFC and FPC connectors can be applied in automotive audio, navigation, infotainment systems, comfort devices, head-up displays (HUD), infotainment systems, instrument panels, lighting, and side-view cameras, among other applications.
Central Information Display of an Automotive Digital Cockpit with Easy-On FFC / FPC Connector
FFC/FPC connectors with dual contacts for secure connections
Molex’s Easy-On FFC and FPC connectors, specifically the FD19 series, support double-bottom contacts. Each connection uses two independent contacts to ensure a secure connectivity, available in various circuit sizes with pitches of 0.50 and 1.00 mm, and can operate at temperatures up to 150°C. These connectors work with eared and non-eared cables.
The FD19 series features anti-vibration (anti-seismic type) "dual contacts" with terminal pitches ranging from 0.50 to 1.00 mm, allowing connections to high-voltage circuits. The number of circuits ranges broadly from 4 to 80, with a height of 1.90 mm.
Customers across various industries demand quick sample provision and a wide array of options. Molex's ultra-thin FD19 series is ideal for use in vibrating environments and offers both 0.50mm and 1.00mm terminal pitch versions for the same design. The FD19 series features a broad front for easy FFC/FPC insertion, produces a loud ‘click’ when locked. For better operability and grip, the connector has a wide area for finger handling, facilitating easy insertion and removal. The connector has a dedicated vacuum nozzle space to facilitate pick-and-place operations. The connector uses low-halogen material for environmental sustainability. The FD19 series is widely applicable, especially in the automotive industry for applications such as automotive navigation, instrument panels, and infotainment systems.
The FD19 series' front flip lid connector actuator simplifies operation and can use latch-type FFC/FPC to achieve a stronger grip on the cables. The connector terminals feature a nickel-plated barrier layer to prevent flux and solder-wicking, with additional latch options if needed. The connectors withstand high temperatures up to 150°C, making them suitable for high-temperature operations. Molex offers a huge variety of micro-connector solutions to meet the most diverse market needs.
Conclusion
The automotive industry is definitely undergoing unprecedented technological changes - changes that not only drive the intelligence and electrification of vehicles but the core electronics with all their associated connectivity technologies (wireless or wired) and interconnect products.
As autonomous driving, vehicle networking, and electric vehicle technologies mature, the vehicle industry will need to leverage more advanced electronic interconnects to support increasingly sophisticated application needs. High-speed, high-performance and highly robust miniature connectors that are easy to use will become a critical part of the automotive ecosystem. Molex is poised to meet the design and manufacturing needs of automakers. Reliability, safety and design flexibility will remain the hallmarks of Molex connectivity solutions for the vehicle of the future.