Wearable Continuous Glucose Monitors (CGMs) are currently popular healthcare applications. However, meeting the growing demand for ultra-compact and discreet CGMs requires new engineering solutions. Users desire smaller devices for comfort and portability while also expecting expanded functionality. This article introduces the development of CGM applications and how advanced technologies from Molex can help manufacturers develop next-generation lightweight CGM devices, offering higher reliability, safe glucose monitoring, and enhanced user experience.
Innovative approaches required for designing continuous glucose monitors
The demand for discreet CGM devices is reshaping product development strategies. Users need smaller, lighter devices that seamlessly integrate into their daily lives. This shift requires innovative approaches in component design and system architecture. Additionally, effective diabetes management begins with consistent and precise glucose readings. To collect reliable data, design teams must address issues such as signal interference, noise reduction, and data accuracy to minimize calibration needs and sensor errors.
On the other hand, maximizing battery life without compromising device performance remains a critical challenge. Engineers are exploring sophisticated power management techniques that adapt to user behavior, sensor activity, and communication requirements. Furthermore, given the complex landscape of medical device regulations, CGM designers must select components with a clear understanding of constraints from the outset of development.
Molex, a renowned connector supplier, leverages its expertise in miniaturization and optimized form factors to develop ultra-compact connectors and components that do not compromise user experience. Molex provides designers with interconnect solutions that ensure optimal signal integrity and reliability, helping maintain signal fidelity for safe and effective diabetes management.
Additionally, Molex’s power management solutions include low-power connectors, power distribution modules, and other energy-saving technologies, which help optimize CGM device power consumption, improve efficiency, and extend battery life. Molex, along with its subsidiary Phillips Medisize, has implemented comprehensive quality management systems compliant with standards such as ISO 13485, assisting device manufacturers in streamlining approval processes and bringing innovations to market faster.
Connectors meeting the design flexibility needs of CGM applications
To address the demands of CGM applications and the growing need for smaller, more reliable devices, Molex’s SlimStack Board-to-Board and Board-to-FPC Connectors provide robust, high-speed data transmission and various design configurations, making them an ideal solution for a wide range of applications across industries.
The increasing demand for smaller, ultra-compact devices is driving the need for miniaturized, reliable, and robust connectors with diverse design options. Many designs require a combination of high-current power, high operating temperatures, electrical reliability, and design flexibility. Molex’s SlimStack Microminiature Board-to-Board and Board-to-FPC Connectors offer a wide range of design options to ensure reliable connections. These micro/fine-pitch plugs and receptacles feature voltage ratings up to 125V, maximum operating temperatures of 125°C, current ratings up to 5.0A for signal connectors, and 15.0A for battery connectors. Additionally, the SlimStack SSB and SSB RP Stacking Connector series provide various stack heights.
In the realm of printed and hybrid electronic assemblies, cutting-edge solutions include printed electronic smart labels, biosensors, and patches. These assemblies integrate various components, sensors, and power sources into compact, easy-to-use form factors, with optional features such as Bluetooth Low Energy (BLE) and other wireless connectivity, delivering unmatched performance and versatility.
Many manufacturers seek solutions leveraging flexible electronics, including but not limited to smart labels, disposable medical wearables, or smart skin patch applications. However, they face challenges when seamlessly integrating various components and materials into their designs. To assist customers, Molex offers extensive capabilities in hybrid electronics, thin-film adhesives, converting (sheet and roll-to-roll), assembly, and final packaging, configured to meet each customer’s unique needs.
As consumers demand smaller, faster, and more powerful devices, Molex’s Micro-Fit Connectors provide a compact, high-performance interconnect solution that balances power and flexibility without compromising space or reliability. These connectors also offer grounding protection and halogen-free components to comply with government regulation guidelines for environment, health and safety (EH&S) compliance. Designed for durability and proficiency, Micro-Fit Connectors are feature-rich, enabling unparalleled design flexibility and significant cost savings.
With the need for thicker PCBs to support higher power demands and the added complexity of multiple signals, design engineers seek ways to maximize PCB space and overcome space constraints in applications. Micro-Fit Connectors deliver a compact, high-performance interconnect solution that balances power and flexibility without sacrificing space or reliability.
Miniaturized interconnect solutions with ultra-low profiles and higher pin density
As CGM devices trend toward smaller sizes, design engineers face the challenge of ensuring functionality in increasingly constrained spaces. As the innovator of the world’s smallest board-to-board connectors, Molex has long provided designers with miniaturized interconnect solutions featuring ultra-low profiles and higher pin density, enabling more discreet and comfortable monitoring solutions.
Flexible Printed Circuits (FPCs) combine the routing and component assembly capabilities of PCBs with the flexibility of cable assemblies, helping designers meet the most challenging space, weight, and performance requirements. Molex FPCs enhance design flexibility, high-speed signal integrity, and reliability through customizable layouts, exceptional impedance control, and superior resistance to heat and vibration, making them ideal for compact and dynamic applications across industries.
Molex FPCs optimize signal integrity through impedance control and shielding, meeting the demands of high-speed, high-performance applications. Their excellent flexibility allows bending and flexing to accommodate complex circuit requirements while simplifying assembly without compromising product longevity or reliability. Enhanced thermal capabilities enable operation in extreme environments, withstanding temperatures as high as +130°C, suitable for diverse application scenarios.
Molex also offers Quad-Row Board-to-Board Connectors to meet CGM application needs. These connectors feature a staggered circuit layout, enabling highly compact packaging for space-constrained applications, allowing manufacturers to maximize productivity while minimizing physical footprint. These connectors deliver robust power to enhance overall efficiency without compromising functionality.
Molex’s Quad-Row Board-to-Board Connectors offer space-saving features, with a low-profile design and a pitch of just 0.175mm. The interior cover provides robustness and protection, while armored and insert-molded nails help prevent connector damage. These connectors simplify system design and enhance functionality, improving performance and capabilities by integrating more circuits into a single connector, reducing the number of connectors required.
On the other hand, CGM designers need to ensure devices provide accurate and reliable glucose measurements. Molex’s 5G technology enables more efficient data transmission, broader compatibility with external devices, and greater space savings. Molex interconnect solutions provide comprehensive EMI shielding for exceptional signal integrity, helping patients effectively monitor and manage their health. Compatible products include USB Connectors (Wire-to-Board) and 5G mmWave RF Flex-to-Board Connectors (signal: 2 to 4, ground: 4 to 6, power: 4 to 0).
CGM devices also require efficient power management to support sensors, data processing units, wireless communication modules, and displays. Molex offers a range of power management interconnect solutions, including low-power connectors, power distribution modules, and power-saving technologies, helping extend battery life and reduce replacement frequency. Compatible products include Micro-Fit Connectors (Wire-to-Wire, Wire-to-Board) and Mini-Fit Connectors (Wire-to-Wire, Wire-to-Board, Board-to-Board).
NTC ring temperature sensor cable assemblies for temperature sensing needs
For temperature sensing requirements, Molex offers NTC Ring Temperature Sensor Cable Assemblies. These assemblies are available in custom and off-the-shelf solutions, with various beta values, resistances, lengths, and temperature ranges to meet diverse application needs. The NTC Ring and Epoxy-Coated Temperature Sensor Cable Assemblies include a ring terminal, thermal conductive epoxy, and/or a Micro-Lock Plus Connector, delivering a market-ready temperature sensing solution.
In the home appliance and consumer electronics industries, temperature sensing systems may be limited to fixed locations within a product. Molex’s ring terminal cable assemblies can be installed anywhere inside the product for accurate temperature sensing. The NTC Ring Terminal Cable Assemblies include Micro-Lock Plus 1.25mm-pitch Connectors, supporting plug-and-play functionality and secure mating retention.
In hard-to-reach areas of equipment, obtaining temperature readings can be challenging. Molex NTC Ring Terminal Cable Assemblies offer various cable lengths for different beta value ranges, enabling temperature sensing in difficult-to-reach locations. For applications requiring different temperature sensitivity levels, engineers may face limitations with one beta value. Molex NTC Ring Terminal Cable Assemblies provide multiple beta values, ensuring accurate sensitivity across tight or broad temperature ranges for applications.
Solutions meeting CGM design safety and reliability requirements
Additionally, Molex’s subsidiary Phillips Medisize develops custom I/O connectors that optimize signal routing and impedance matching, helping CGM design engineers minimize signal loss and interference. CGM devices must also comply with stringent safety and reliability regulatory guidelines. Phillips Medisize’s expertise in contract manufacturing, combined with quality management systems and comprehensive testing, helps customers streamline production processes while maintaining compliance.
In applicator and housing molding and assembly, Phillips Medisize’s advanced precision molding capabilities assist engineers in designing for manufacturability while leveraging safety and quality systems to ensure compliance. Furthermore, Phillips Medisize has extensive experience in the integration, molding, and assembly of sharps, ensuring CGM devices meet rigorous biocompatibility safety standards.
Human factors engineering is essential for creating user-friendly interfaces for CGM device readers and apps, which are critical for effective disease management and patient-reported outcomes. Phillips Medisize’s deep expertise in user experience design, electronic and software engineering, and social science, psychology, and human factors ensures intuitive interfaces that provide seamless access to critical information. Phillips Medisize also offers user-centric software and hardware solutions that enhance disease management and patient experience.
Conclusion
The advancement of next-generation CGMs relies not only on core sensing technology but also on highly integrated interconnect design and precise, stable temperature sensing solutions. Advanced flexible circuits and miniature connectors enhance wearability and signal stability, while high-precision temperature sensing technology assists with temperature compensation to improve the accuracy and reliability of glucose data. Molex’s diverse range of connectors and temperature sensing solutions will continue to drive continuous glucose monitoring systems toward smaller, smarter, and more reliable designs, offering diabetic patients a more convenient and reassuring health management experience.