Boyd Corporation-374624B00035G Dissipateur thermique Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized

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Boyd Corporation374624B00035GDissipateur thermique

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized

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Symbols and Footprints

Compliant

EAR99

Active

8542.90.00.00

Automotive

Unknown

PPAP

Unknown

Passive

Aluminum

23.4

Pin Array

BGA|FPGA

Tape

Black Anodized

Adhesive

35

35

10

EDA / CAD Models

Import TariffMay apply to this part

972 pièces: Livraison en 2 jours

En stock
Livraison en 2 jours
Ships from:
États Unis
Date Code:
2450+
Manufacturer Lead Time:
6 semaines
Country Of origin:
Chine
- In Stock: 972 pièces
- Price: $3.667