Analog DevicesADAQ23875BBCZSystème d’acquisition de données
16-bit, 15MSPS μModule Data Acquisition Solution
The ADAQ23875 is a precision, high speed, μModule® data acquisition solution that reduces the development cycle of a precision measurement system by transferring the design burden of component selection, optimization, and layout from the designer to the device.
Using system-in-package (SIP) technology, the ADAQ23875 reduces end system component count by combining multiple common signal processing and conditioning blocks in a single device, solving many design challenges. These blocks include a low noise, fully differential analog-to-digital converter (ADC) driver (FDA), a stable reference buffer, and a high speed, 16-bit, 15 MSPS successive approximation register (SAR) ADC.
Key Features and Benefits
● Incorporates common signal conditioning functions required in precision, high speed Data Acquisition Solutions in a single package simplifying the design challenge associated with achieving optimum performance in high resolution data acquisition designs
● 4x smaller footprint than discrete equivalent without compromising performance
● Superior matching and drift characteristics of the signal scaling resistors (iPassive®) minimizes the signal chain gain error and gain error drift temperature thereby removing the need for calibration in manufacturing and operation
Applications
● Instrumentation: Power Analyzer, Hardware In The Loop, Optical Measurement Systems, Optical Inspection systems, SMU Digital control loop, Non-destructive test, Mass spectrometry
● Healthcare: Flow Cytometry, Digital Xray
● Energy: Travelling wave fault location
● General Purpose: Digital control loops, Wide bandwidth precision DAQ
Evaluation Board
The ADAQ23875 can be evaluated with theEVAL-ADAQ23875FMCZ.
Block Diagrams and Tables
| Compliant | |
| EAR99 | |
| Active | |
| 8542.39.00.30 | |
| Automotive | No |
| PPAP | No |
| ADC | |
| 18 | |
| Single|Dual | |
| 1 | |
| Serial LVDS | |
| 4.75 | |
| 5 | |
| 5.25 | |
| -0.95/4.75 | |
| -1/5 | |
| -1.05/5.25 | |
| ±1LSB | |
| 89.5(Typ) | |
| -40 | |
| 85 | |
| Tray | |
| ±0.045%FSR | |
| Installation | Surface Mount |
| Hauteur du paquet | 1.92 mm |
| Largeur du paquet | 9 mm |
| Longueur du paquet | 9 mm |
| Carte électronique changée | 100 |
| Nom de lemballage standard | BGA |
| Conditionnement du fournisseur | CSP-BGA |
| 100 | |
| Forme de sonde | Ball |
| EDA / CAD Models |
Des dispositifs médicaux alimentés par l'IA
Livre blanc Arrow : conseils et informations sur l'IA pour la conception de solutions de diagnostic & thérapie rapides et sûres.
