RSL10: Radio SoC, Bluetooth® 5 Certified, SDK 3.3
Offering the industry’s lowest power consumption, RSL10 enables advanced wireless features while optimizing system size and battery life. The highly-integrated radio SoC features a dual-core architecture and a 2.4 GHz transceiver, providing the flexibility to support Bluetooth Low Energy and 2.4 GHz custom protocols. The ready-to-use RSL10 SIP features an integrated antenna, RSL10 Radio SoC , and all passive components in a single, miniature package.
The RSL10 Software Development Kit (SDK) enables rapid development of ultra-low power Bluetooth Low Energy applications by leveraging convenient abstraction, drivers and sample applications from Blinky to complete BLE peripherals, and everything in between.
Key features:
• Free Eclipse-based ON Semiconductor IDE plus support for Keil uVision® and IAR Embedded Work Bench®
• Complete Bluetooth Low Energy protocol stack
• Bluetooth Low Energy mesh networking with Android app
• FOTA (Firmware Over The Air) with Android and iOS apps
• FreeRTOS
Ultra-Low-Power:
• Industry's lowest power consumption in Deep Sleep Mode (62.5 nW) and Rx in Receive Mode (7 mW)
• Industry's best EEMBC® ULPMark™ scores (1090 ULPMark CP @ 3 V; 1260 @ 2.1 V)
Advanced Multi-Protocol Wireless Functionality:
• Rx Sensitivity: - 94 dBM
• Transmitting Power: -17 to +6 dBm
• Supports Bluetooth Low Energy and 2.4 GHz proprietary/custom protocols
• Supports Firmware Over The Air (FOTA)
Flexible Voltage Supply Range (1.1 and 3.3 V):
• Supports devices using 1.2 and 1.5 V batteries without a required external DC/DC converter
Ultra-Miniature:
• RSL10 is offered in a 5.50 mm2 WLCSP and a 6 x 6 mm QFN. For added miniaturization, the radio SoC is also available in a complete System-in-Package (SiP) solution.
Sophisticated Dual-Core Architecture:
• Features a programmable Arm Cortex-M3 processor for clocking speeds up to 48 MHz and the flexibility to support 2.4 GHz proprietary and custom protocol stacks. An embedded Digital Signal Processor (DSP) enables signal processing intensive applications, such as wireless audio codecs.
On-Chip and Software Wireless Support:
• Features a 2.4 GHz Radio Frequency Front-End (RFFE) and a Bluetooth 5 certified baseband controller which supports 2 Mbps data rates. A wide range of supported Bluetooth low energy protocols are provided in the RSL10 development tools kit.
Highly-Integrated System-on-Chip (SoC):
• The powerful dual-core architecture is complemented by high-efficiency power management units, oscillators, flash, and RAM memories, a DMA controller, and peripherals and interfaces.
Other Key Technical Features:
• 384 kB of flash memory • IP protection feature to secure flash contents • Configurable analog and digital sensor interfaces (GPIOs, LSADs, I2C, SPI, PCM)
Applications
• IoT Edge-Node Applications
• Bluetooth Low Energy Technology
• Wearables
• Energy Harvesting
End Products
• Fitness Trackers/Activity Monitors
• Smart Watches
• Hearing Aids/Hearables
• Heart Rate Monitors
• Blood Glucose Monitors (BGM)
• Continuous Glucose Monitors (CGM)
• Pulse Oximeters
• Appliances (e.g., A/C, fans, etc.)
• Smart Locks
• Lighting Applications
• Automotive Applications
Related Content:
Learn More About ON Semiconductor’s RSL10 Bluetooth
Learn More Applications from ON Semiconductor
Related Products
Product Technical Specifications
EU RoHS
Compliant
ECCN (US)
5A991g.
Part Status
Active
HTS
8542.31.00.75
Automotive
No
PPAP
No
Type
Chip
Protocols Supported
Bluetooth v5.2 (BLE)
Processing Unit Type
Microprocessor
Maximum Data Rate (Mbps)
3
Maximum Operating Frequency (MHz)
2400(Typ)
Typical Sensitivity (dBm)
-96
Interface Type
GPIO/SPI/UART
Minimum Operating Supply Voltage (V)
1.18
Typical Operating Supply Voltage (V)
1.25
Maximum Operating Supply Voltage (V)
3.3
Antenna Mounting
On Board
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Packaging
Tape and Reel
Mounting
Surface Mount
Package Height
1.46
Package Width
6
Package Length
8
PCB changed
51
Supplier Package
SIP SMD
Pin Count
51