Murata ManufacturingLBEE5PL2DL-921Combo Wireless Modules
WLAN+BT Module 2412MHz to 2472MHz/5180MHz to 5825MHz 107-Pin
Featured Enablers
LBEE0ZZ1WE-USD-M2
LBEE0ZZ2WE-USD-M2
LBEE0ZZ2WF-USD-M2
MIMXRT1160-EVK
MIMXRT1064-EVK
8MMINILPD4-EVKB
8MNANOLPD4-EVK
EAK00329
MCIMX6UL-EVKB
MCIMX6ULL-EVK
EAK00347
EAK00360
IMXRT1050-EVKB
MIMXRT1060-EVK
MIMXRT1060-EVKB
MIMXRT1170-EVK
MIMXRT1170-EVKB
MIMXRT685-EVK
MIMXRT595-EVK
MCIMX8ULP-EVK
8MPLUSLPD4-EVK
MCIMX93-EVK
Type 2DL is a small and very high performance module based on NXP IW611 combo chipset which supports Wi-Fi® 802.11a/b/g/n/ac/ax + Bluetooth® 5.3 BR/EDR/LE up to 601Mbps PHY data rate on Wi-fi® and 2Mbps PHY data rate on Bluetooth®. The WLAN section supports SDIO v3.0 DDR50 interface and the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data.
The IW611 implements highly sophisticated enhanced collaborative coexistence hardware mechanisms and algorithms, which ensure that WLAN, and Bluetooth® collaboration is optimized for maximum performance.
In IEEE 802.11ax mode, the WLAN operation supports rates of MCS0-MCS11 (up to 1024QAM) in 20MHz,40MHz and 80MHz channels for data rate up to 601Mbps.
Type 2DL module is packaged in an impressively small shielded form factor that facilitates integration into size- and power-sensitive applications such as IoT applications, handheld wireless system, gateway and more.
Shielded Ultra Small Wi-Fi® 11a/b/g/n/ac/ax + Bluetooth® 5.3
- • 2.4GHz & 5GHz Wi-Fi® + Bluetooth®
- • Chipset: NXP IW611
- • Processor: No
- • FCC/IC "Reference" Certified
High Performance Capabilities for Internet of Things
- • For Smart Home, Sensor Network, Audio/Video/Voice, Gateway
- • 802.11 a/b/g/n/ac/ax 1x1 601Mbps
- • NXP i.MX Linux and Android
Block Diagram
| Compliant with Exemption | |
| 5A992c. | |
| Active | |
| 8517.62.00.90 | |
| WLAN+BT | |
| Module | |
| 54 | |
| 2412 to 2472|5180 to 5825 | |
| 2402 to 2480 | |
| HCI|UART | |
| 16dBm | |
| -40 | |
| 85 | |
| Bluetooth v5.3 BR/EDR/LE | |
| IEEE 802.11a/b/g/n/ac/ax | |
| Mounting | Surface Mount |
| Package Height | 1.3(Max) |
| Package Width | 7.7 |
| Package Length | 8.8 |
| PCB changed | 107 |
| 107 |
| EDA / CAD Models |
Design AI-powered medical devices
Explore system design tips, part recs and AI insights to help you build faster, safer diagnostic and therapy solutions—all in Arrow’s latest white paper.

