Winbond ElectronicsW25N01GVZEIG/REELFlash
SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 7ns 8-Pin WSON EP Tray
| Compliant | |
| 3A991.b.1.a | |
| Active | |
| EA | |
| SVHC | Yes |
| Automotive | No |
| PPAP | No |
| SLC NAND | |
| 1G | |
| Sectored | |
| No | |
| Symmetrical | |
| 32 | |
| 128Kbyte x 1024 | |
| 2Kbyte | |
| 8 | |
| 128M | |
| Yes | |
| Synchronous | |
| 7 | |
| 0.01/Block | |
| 0.7/Page | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 2.7 | |
| 104 | |
| 3|3.3 | |
| 3.6 | |
| 2.7 to 3.6 | |
| 35 | |
| 35 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| Yes | |
| Yes | |
| 100000 | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 0.73 mm |
| Package Width | 8 mm |
| Package Length | 6 mm |
| PCB changed | 8 |
| Standard Package Name | SON |
| Supplier Package | WSON EP |
| 8 | |
| Lead Shape | No Lead |
| EDA / CAD Models |
Progetta dispositivi medici guidati dall'IA
White paper: consigli su progettazione e componenti e approfondimenti IA per soluzioni diagnostiche e terapeutiche più veloci e sicure.