RoHS (Unione Europea) | Compliant |
ECCN (Stati Uniti) | EAR99 |
Stato del componente | Active |
Codice HTS | COMPONENTS |
Automotive | No |
PPAP | No |
Logic Family | LVC |
Logic Function | Bus Transceiver |
Data Flow Direction | Bi-Directional |
Number of Elements per Chip | 1 |
Number of Channels per Chip | 8 |
Number of Selection Inputs per Element | 0 |
Number of Output Enables per Element | 1 Low |
Number of Input Enables per Element | 0 |
Number of Direction Control Inputs | 1 Low/High |
Bus Hold | No |
Polarity | Non-Inverting |
Absolute Propagation Delay Time (ns) | 17 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 6.1@3.3V|7.1@2.7V |
Propagation Delay Test Condition (pF) | 50 |
Process Technology | 1um |
Input Level | TTL|LVTTL |
Output Level | LVCMOS |
Output Type | 3-State |
Maximum Low Level Output Current (mA) | 24 |
Maximum High Level Output Current (mA) | -24 |
Maximum Quiescent Current (uA) | 1 |
Minimum Operating Supply Voltage (V) | 1.65 |
Maximum Operating Supply Voltage (V) | 3.6 |
Tolerant I/Os (V) | 5 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 125 |
Supplier Temperature Grade | Commercial |
Packaging | Tape and Reel |
Mounting | Surface Mount |
Package Height | 2.35(Max) |
Package Width | 7.5 |
Package Length | 12.8 |
PCB changed | 20 |
Standard Package Name | SO |
Supplier Package | SOIC |
Pin Count | 20 |
Lead Shape | Gull-wing |