Infineon Technologies AGS25HL512TFAMHI010Flash
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 512M-bit 512M/256M/128M x 1/2-bit/4-bit 9ns 16-Pin SOIC W Tray
| Compliant | |
| 3A991.b.1.a | |
| Active | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| NOR | |
| 512M | |
| Sectored | |
| Yes | |
| Symmetrical | |
| Bottom|Top | |
| 32 | |
| 256Kbyte x 256 | |
| 256byte|512byte | |
| 1/2/4 | |
| 512M/256M/128M | |
| Yes | |
| Synchronous | |
| 9 | |
| 696/Chip | |
| 1.7/Page | |
| 45nm | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 2.7 | |
| 166 | |
| 3|3.3 | |
| 3.6 | |
| 2.7 to 3.6 | |
| 69 | |
| 58 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| Yes | |
| No | |
| 1280000 | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 2.55(Max) |
| Package Width | 7.5 |
| Package Length | 10.3 |
| PCB changed | 16 |
| Standard Package Name | SO |
| Supplier Package | SOIC W |
| 16 |
| EDA / CAD Models |
Sistemi di droni più intelligenti: dal progetto al decollo
Scarica la guida e dotati di tutti gli strumenti e strategie intelligenti per progettare i sistemi di droni del futuro: agili, efficienti e modulari.