| RoHS (Unione Europea) | Not Compliant |
| ECCN (Stati Uniti) | EAR99 |
| Stato del componente | Active |
| Codice HTS | 8541.29.00.95 |
| Automotive | No |
| PPAP | No |
| Categoria prodotti | Power MOSFET |
| Process Technology | HEXFET |
| Configuration | Single |
| Channel Mode | Enhancement |
| Channel Type | N |
| Number of Elements per Chip | 1 |
| Maximum Drain-Source Voltage (V) | 200 |
| Maximum Gate-Source Voltage (V) | ±20 |
| Maximum Continuous Drain Current (A) | 18 |
| Maximum Drain-Source Resistance (mOhm) | 210@10V |
| Typical Gate Charge @ Vgs (nC) | 60(Max)@10V |
| Typical Gate Charge @ 10V (nC) | 60(Max) |
| Typical Input Capacitance @ Vds (pF) | 1300@25V |
| Maximum Power Dissipation (mW) | 125000 |
| Typical Fall Time (ns) | 67(Max) |
| Typical Rise Time (ns) | 152(Max) |
| Typical Turn-Off Delay Time (ns) | 58(Max) |
| Typical Turn-On Delay Time (ns) | 20(Max) |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 150 |
| Mounting | Through Hole |
| Package Height | 7.74(Max) mm |
| Package Width | 25.53(Max) mm |
| Package Length | 39.37(Max) mm |
| PCB changed | 2 |
| Tab | Tab |
| Standard Package Name | TO |
| Supplier Package | TO-3 |
| Pin Count | 3 |
| Lead Shape | Through Hole |
