| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | 3A001a.5.b.2.b. |
| Stato del componente | Active |
| Codice HTS | 8542.39.00.40 |
| Automotive | No |
| PPAP | No |
| Converter Type | RF |
| Process Technology | 0.18um, CMOS |
| Architecture | Quad-Switch |
| Resolution | 14bit |
| Conversion Rate | 2.5Gsps |
| Number of DAC Channels | 1 |
| Number of Outputs per Chip | 1 |
| Maximum Settling Time (us) | 0.013(Typ) |
| Interface Type | LVDS |
| Output Type | Current |
| Output Polarity | Unipolar |
| Voltage Reference | Internal|External |
| Minimum Single Supply Voltage (V) | 3.1 |
| Power Supply Type | Analog and Digital |
| Maximum Power Dissipation (mW) | 975 |
| Integral Nonlinearity Error | ±1.3LSB(Typ) |
| Full Scale Error | 5.5%FSR(Typ) |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.93 |
| Package Width | 12 |
| Package Length | 12 |
| PCB changed | 160 |
| Standard Package Name | BGA |
| Supplier Package | CSP-BGA |
| Pin Count | 160 |
| Lead Shape | Ball |
