| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | EAR99 |
| Stato del componente | Active |
| Codice HTS | 8536.10.00.40 |
| Automotive | No |
| PPAP | No |
| Type | Chip |
| Acting | Slow Blow |
| Application | Computer|Data Modem|Display|Gaming Console|Printer|Scanner|Server |
| Fuse Size (mm) | 3.2 X 1.63 X 0.84 |
| Current Rating (A) | 6 |
| Maximum Voltage Rating (V) | 24 |
| Maximum DC Voltage Rating (V) | 24 |
| Maximum Power Dissipation (W) | 0.78(Typ) |
| Typical Melting I2t (A²S) | 15.56 |
| Termination Style | Solder Pad |
| Number of Terminals | 2 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 150 |
| Product Depth (mm) | 1.63 |
| Product Length (mm) | 3.2 |
| Product Height (mm) | 0.835 |
| Fuse Material | Ceramic |
| Mounting | Surface Mount |
| Package/Case | 1206 |