KIOXIATHGJFAT1T84BAIRFlash
TLC NAND Flash Serial e-MMC 2.5V/3.3V 2T-bit 153-Pin FBGA
KIOXIA – New Generation of UFS with thinner profile and faster read/write speeds
KIOXIA pushes performance boundaries with new Ver. 3.1 UFS embedded flash memory devices
Applications
• Consumer Electronics
• Multimedia Applications
• Industrial Applications
• Smart Applications
1. Performance increase of approximately 30% for random read and approximately 40% for random write.
2. Host Performance Booster (HPB) Ver. 2.0: Improves random read performance by utilizing the host side memory to store logical to physical translation tables. While HPB Ver. 1.0 only enables 4KB chunk size access, HPB Ver. 2.0 enables wider access - which can further boost random read performance.
3. Thinner 256GB package at just 0.8mm height.
4. High speed interface up to 1160 MB/sec / 2320 MB/sec
5. Managed memory
6. Package, interface, features, commands, etc. are standard
Spec
Density 256GB – 512GB
Technology BiCS FLASH™ 3D flash memory technology
JEDEC Version 3.1
Temperature -25° C to 85° C
Learn More on KIOXIA Memories
Related Products
| Compliant | |
| 3A991.b.1.a | |
| Unconfirmed | |
| 8542.32.00.71 | |
| Automotive | Unknown |
| PPAP | Unknown |
| TLC NAND | |
| 2T | |
| Yes | |
| Synchronous | |
| Serial e-MMC | |
| 2.4 | |
| 2.5|3.3 | |
| 3.6 | |
| -25 | |
| 85 | |
| Yes | |
| Yes | |
| Mounting | Surface Mount |
| Package Width | 11.5 |
| Package Length | 13 |
| PCB changed | 153 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 153 |
| EDA / CAD Models |
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