| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.31.00.60 |
| Automotive | No |
| PPAP | No |
| Family Name | ProASIC®3 |
| Process Technology | 130nm |
| User I/Os | 157 |
| Number of I/O Banks | 4 |
| Number of Inter Dielectric Layers | 7 |
| Number of Registers | 6144 |
| Operating Supply Voltage (V) | 1.5 |
| Device System Gates | 250000 |
| Program Memory Type | Flash |
| Embedded Memory (Kbit) | 36 |
| Total Number of Block RAM | 8 |
| Device Logic Gates | 250000 |
| Number of Global Clocks | 18 |
| Device Number of DLLs/PLLs | 1 |
| Maximum Supply Current (mA) | 20 |
| JTAG Support | Yes |
| Programmability | Yes |
| Reprogrammability Support | Yes |
| Copy Protection | No |
| Opr. Frequency (MHz) | 310 |
| In-System Programmability | Yes |
| Speed Grade | 2 |
| Differential I/O Standards | LVDS|LVPECL|B-LVDS|M-LVDS |
| Single-Ended I/O Standards | LVTTL|LVCMOS |
| Maximum Differential I/O Pairs | 38 |
| Maximum I/O Performance | 700Mbps |
| Minimum Operating Supply Voltage (V) | 1.425 |
| Maximum Operating Supply Voltage (V) | 1.575 |
| I/O Voltage (V) | 1.5|1.8|2.5|3.3 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Commercial |
| Packaging | Tray |
| Tradename | ProASIC |
| Mounting | Surface Mount |
| Package Height | 1.2 mm |
| Package Width | 17 mm |
| Package Length | 17 mm |
| PCB changed | 256 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 256 |
| Lead Shape | Ball |
