フラッシュ

PC28F256P33TFE

NOR Flash Parallel/Serial 2.5V/3V/3.3V 256M-bit 16M x 16 95ns 64-Pin EBGA Tray

Micron Technology

製品技術仕様

• RoHS (Unione Europea)

  Compliant

• ECCN (Stati Uniti)

  3A991b.1.a.

• Stato del componente

  Obsolete

• Codice HTS

  8542.32.00.71

• Automotive

  No

• PPAP

  No

• Cell Type

  NOR

• Chip Density (bit)

  256M

• Architecture

  Sectored

• Boot Block

  Yes

• Block Organization

  Asymmetrical

• Location of Boot Block

  Top

• Address Width (bit)

  24

• Sector Size

  32Kbyte x 4|128Kbyte x 255

• Page Size

  16Words

• Number of Bits/Word (bit)

  16

• Number of Words

  16M

• Programmability

  Yes

• Timing Type

  Asynchronous|Synchronous

• Max. Access Time (ns)

  95

• Maximum Erase Time (s)

  4

• Maximum Page Access Time (ns)

  25

• Maximum Programming Time (ms)

  0.456/Word

• OE Access Time (ns)

  25

• Process Technology

  65nm

• Interface Type

  Parallel|Serial

• Maximum Operating Frequency (MHz)

  52

• Minimum Operating Supply Voltage (V)

  2.3

• Typical Operating Supply Voltage (V)

  2.5|3|3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Programming Voltage (V)

  8.5 to 9.5

• Operating Current (mA)

  31

• Page Read Current (mA)

  16

• Program Current (mA)

  50

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Command Compatible

  Yes

• ECC Support

  Yes

• Support of Page Mode

  Yes

• Minimum Endurance (Cycles)

  100000

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.78

• Package Width

  10

• Package Length

  13

• PCB changed

  64

• Standard Package Name

  BGA

• Supplier Package

  EBGA

• Pin Count

  64

• Lead Shape

  Ball