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MT35XU02GCBA1G12-0SIT

NOR Flash Serial-SPI 1.8V 2G-bit 256M x 8 24-Pin TBGA Tray

Micron Technology

製品技術仕様

• RoHS (Unione Europea)

  Compliant

• ECCN (Stati Uniti)

  3A991b.1.a.

• Stato del componente

  LTB

• Codice HTS

  COMPONENTS

• SVHC

  Yes

• Automotive

  No

• PPAP

  No

• Cell Type

  NOR

• Chip Density (bit)

  2G

• Architecture

  Sectored

• Boot Block

  Yes

• Block Organization

  Symmetrical

• Address Width (bit)

  32

• Sector Size

  128Kbyte x 2048

• Page Size

  256byte

• Number of Bits/Word (bit)

  8

• Number of Words

  256M

• Programmability

  Yes

• Timing Type

  Synchronous

• Interface Type

  Serial-SPI

• Minimum Operating Supply Voltage (V)

  1.7

• Typical Operating Supply Voltage (V)

  1.8

• Maximum Operating Supply Voltage (V)

  2

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Command Compatible

  Yes

• ECC Support

  No

• Support of Page Mode

  No

• Minimum Endurance (Cycles)

  100000

• Packaging

  Tray

• Mounting

  Surface Mount

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  TBGA

• Pin Count

  24

• Lead Shape

  Ball