DRAMチップ

EDB8132B4PB-8D-F-D

DRAM Chip Mobile LPDDR2 SDRAM 8Gbit 256Mx32 1.8V/1.2V 168-Pin FBGA Tray

Micron Technology

製品技術仕様

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Obsolete

• HTS

  8542.32.00.36

• Automotive

  No

• PPAP

  No

• DRAM Type

  Mobile LPDDR2 SDRAM

• Chip Density (bit)

  8G

• Organization

  256Mx32

• Number of Internal Banks

  8

• Number of Words per Bank

  32M

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  800

• Address Bus Width (bit)

  14

• Process Technology

  25nm

• Interface Type

  HSUL

• Minimum Operating Temperature (°C)

  -30

• Maximum Operating Temperature (°C)

  85

• Number of I/O Lines (bit)

  32

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.45

• Package Width

  12

• Package Length

  12

• PCB changed

  168

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  168

• Lead Shape

  Ball