ヒューズ

C1F 375

Fuse Chip Fast Acting 0.375A 125V SMD Solder Pad 1206 3.2 X 1.58 X 0.63mm Ceramic T/R Automotive AECQ

Bel

製品技術仕様

• 欧盟RoHS指令

  Compliant

• 美国出口管制分类ECCN编码

  EAR99

• 环保无铅

  Active

• 美国海关商品代码

  8536.10.00.40

• Automotive

  Yes

• Type

  Chip

• Acting

  Fast

• Application

  Office Electronic Equipment|Notebook|Medical Equipment|Industrial Equipment|Automotive Navigation System

• Fuse Size (mm)

  3.2 X 1.58 X 0.63

• Current Rating (A)

  0.375

• Maximum Voltage Rating (V)

  125

• Maximum AC Voltage Rating (V)

  125

• Maximum DC Voltage Rating (V)

  63

• Maximum Power Dissipation (W)

  0.3

• Typical Melting I2t (A²S)

  0.0007

• Termination Style

  Solder Pad

• Number of Terminals

  2

• Minimum Operating Temperature (°C)

  -55

• Maximum Operating Temperature (°C)

  125

• Packaging

  Tape and Reel

• Product Depth (mm)

  1.58

• Product Length (mm)

  3.2

• Product Height (mm)

  0.63

• Fuse Material

  Ceramic

• Mounting

  Surface Mount

• Package/Case

  1206