ヒューズ

0ABB-3500-TM

Fuse Chip 3.5A 32V SMD Solder Pad 0603 Ceramic Automotive AEC-Q200

Bel Power Solutions

製品技術仕様

• RoHS (Unión Europea)

  Compliant

• ECCN (Estados Unidos)

  EAR99

• Estatus de pieza

  Active

• Código HTS

  8536.10.00.40

• Automotive

  Yes

• PPAP

  Unknown

• Type

  Chip

• Application

  Battery|Electronic Device

• Fuse Size (mm)

  1.6 X 0.81 X 0.48

• Current Rating (A)

  3.5

• Maximum Voltage Rating (V)

  32

• Maximum DC Voltage Rating (V)

  32

• Typical Melting I2t (A²S)

  0.5

• Termination Style

  Solder Pad

• Number of Terminals

  2

• Minimum Operating Temperature (°C)

  -55

• Maximum Operating Temperature (°C)

  150

• Packaging

  Tape and Reel

• Product Depth (mm)

  0.81

• Product Length (mm)

  1.6

• Product Height (mm)

  0.48

• Fuse Material

  Ceramic

• Mounting

  Surface Mount

• Package/Case

  0603