LFCPNX-100-7BBG484I
Advanced General Purpose FPGAs
Lattice SemiconductorLattice CertusPro™-NX: Advanced General Purpose FPGAs
Built on the 28 nm FD-SOI Lattice Nexus™ platform, CertusPro-NX FPGAs deliver best-in-class power efficiency, system bandwidth, and memory capabilities to Edge applications. With advanced performance and the highest logic density currently available on a Nexus-based device, CertusPro-NX FPGAs are designed to accelerate application development for the Communications, Compute, Industrial, Automotive, and Consumer markets.
Applications
CertusPro-NX FPGAs are designed to enable customer innovation in a wide range of applications, including data co-processing in intelligent systems, high-bandwidth signal bridging in 5G communications infrastructure, and sensor interface bridging in ADAS systems.
Application Photos
Smart SFP+ Optical Module
• Implement enhanced Ethernet functions (e.g., Ethernet demarcation, OAM processing, SLA monitoring, etc.)
• Compact packages as small as 9x9 mm with 10 Gigabit Ethernet support and 100K Logic Cells
• Class-leading power efficiency for simpler thermal management
• Hardened 10 Gigabit Ethernet PCS blocks supporting 10GBASE-R at 10.3125 Gbps, and available Ethernet MAC IP
Control Plane Security and Hardware Management
• Bridge CPU via PCIe to multiple control plane peripherals (I2C, UART, GPIO), board management functions, and 10GE control plane traffic
• Security functions (e.g., encryption, authentication) implemented in FPGA helps secure control plane traffic
• 10G SERDES supporting PCIe Gen 3 x4 (in hard IP) and 10 Gigabit Ethernet (with 10GBASE-R PCS in hard IP)
• High system reliability and up-time due to 100x lower Soft Error Rate (SER) from FD-SOI technology
• Fast FPGA configuration supports board management needs and PCIe boot-time requirements
Machine Vision
• Vision processing and bridging for high performance SLVS-EC sensors
• 10G SERDES supporting SLVS-EC sensor interface, 10 GigE Vision and CoaXPress
• 9x9 mm small size package and class-leading power efficiency meets stringent requirements of space and thermal budget constrained camera modules
• Up to 7.3 Mb on-chip memory for ISP and vision processing
• LPDDR4 external memory support for optional frame buffering
Frame Grabber
• Image acquisition, pre-processing and DMA over PCIe to host PC
• 10G SERDES supporting 10 GigE Vision, CoaXPress and PCIe Gen 3 x4 (in hard IP)
• Up to 7.3 Mb on-chip memory for video processing / tagging
• LPDDR4 external memory support for optional frame buffering
Smart Camera AI Processing
• Offload AI processing and ISP from SoC
• Interface with popular image sensors over MIPI at up to 1.5 Gbps per lane, using High Performance IO (HPIO)
• Up to 7.3 Mb on-chip memory and flexible DSP resources to efficiently perform AI processing and ISP
• LPDDR4 external memory support for frame buffering
• Flexible output over MIPI or PCIe to SoC to enable smart device with high quality imaging
Features and Benefits
10G SERDES at Lowest Power and Smallest Package – Up to 8 SERDES lanes supporting up to 10.3 Gbps per lane, in packages as small as 9x9 mm. Up to 4x lower power vs. similar FPGAs.
More On-chip Memory, and LPDDR4 Support – Up to 7.3 Mb of on-chip memory. Only FPGA in class with LPDDR4 support. LPDDR4, DDR3/3L, LPDDR2 supported at 1066 Mbps.
Built on Lattice Nexus platform – Class-leading power efficiency. Up to 100x higher reliability, due to 100x lower Soft Error Rate (SER) from 28 nm FD-SOI technology.
Features
- • Up to 100K logic cells, 7.3 Mb of embedded memory blocks (EBR, LRAM), 156 18 x 18 multipliers, 299 programmable I/O, 8 SERDES supporting up to 10.3 Gbps per lane and supporting popular protocols (10 Gig Ethernet, PCIe Gen 3, DisplayPort, SLVS-EC and CoaXPress).
- • Packages as small as 9x9 mm, and in ball-pitch options of 0.5, 0.8 and 1.0 mm.
- • Power modes – User selectable Low Power vs. High Performance modes, enabled by FD-SOI programmable back-bias.
- • Design security – ECDSA bitstream authentication, coupled with robust AES-256 encryption.
- • Fast configuration – I/O configures in 4 ms, and full-device in under 30 ms in 100K LC device.
- • Supported by Lattice Radiant™ design software and compatible with Lattice sensAI™, Lattice mVision™, Lattice Sentry™, and Lattice Automate™ solution stacks.
Featured Content
Lattice CertusPro-NX Data Sheet
Whitepaper: Lattice CertusPro-NX Reinvigorates General Purpose FPGAs
Lattice Sentry Solution Stack Brochure
Lattice sensAI Solution Stack Brochure
Lattice mVision Solution Stack Brochure
Lattice Automate Solution Stack Brochure
Lattice Radiant Design Software Product Brochure
Related Articles & Videos
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Spécifications techniques du produit
RoHS (Union Européenne)
Compliant
ECCN (États-Unis)
3A991d.
Statut de pièce
Active
Code HTS
8542.31.00.60
Automotive
No
PPAP
No
Technologie de traitement
28nm
Nombre maximal d'E/S d'utilisateur
299
Nombre de banques E/S
8
Tension d’alimentation type en fonctionnement (V)
1
Cellules logiques de l'appareil
100000
Nombre de multiplicateurs
156 (18x18)
Type de mémoire programme
SRAM
Bits RAM (Kbit)
3584
Nombre total de blocs RAM
7
Bits maximaux de RAM distribués
654336
Nombre maximal de canaux SERDES
8
Unités logiques du dispositif
100000
Numéro de dispositif des DLL/PLL
4
DSP dédié
156
Programmabilité
Yes
Support de reprogrammabilité
No
Protection contre la copie
No
Programmabilité dans le système
Yes
Grade de vitesse
7
Standards de différentiel E/S supporté
LVTTL|LVCMOS
E/S Standards à mécanique unique prises en charge
LVTTL|LVCMOS
Tension d'alimentation minimale en fonctionnement (V)
0.95
Tension d'alimentation maximale en fonctionnement (V)
1.05
Tension E/S (V)
1.2|1.35|1.8|2.5|3.3|1
Température de fonctionnement minimale (°C)
-40
Température de fonctionnement maximale (°C)
100
Échelle de température du fournisseur
Industrial
Nom commercial
CertusPro
Installation
Surface Mount
Hauteur du paquet
0.65(Min)
Largeur du paquet
19
Longueur du paquet
19
Carte électronique changée
484
Nom de lemballage standard
BGA
Conditionnement du fournisseur
CABGA
Décompte de broches
484

