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LFD2NX407BG256I|LATTICE|simage
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Field Programmable Gate Arrays - FPGAs

LFD2NX-40-7BG256I

FPGA Certus-NX Family 39000 Cells 28nm Technology 1V 256-Pin CABGA

Lattice Semiconductor
Datasheets 

Lattice Certus™-NX: Reinventing the Low-Power General Purpose FPGA

Built on the 28 nm FD-SOI Lattice Nexus™ platform, the Certus-NX family of FPGAs lead the general-purpose FPGA market in I/O density, delivering up to twice the I/O density per mm2 in comparison to similar competing FPGAs, and provide best-in-class power savings, small size, reliability, instant-on performance, and support fast PCI Express (PCIe) and Gigabit Ethernet interfaces to enable data co-processing, signal bridging, and system control.

Product Highlights

Applications: Lattice Certus-NX FPGAs are designed to deliver leadership performance for a range of applications, from automated industrial equipment operating at the edge, to 5G communications infrastructure, and cloud datacenters. Certus-NX is well suited for Internet-connected devices, artificial intelligence (AI) workloads, a variety of communications tasks, and for motor and sensor control.







Benefits

Industry-leading I/O Count in Small Packages  – Up to 2x more I/O per mm2 vs. similar FPGAs, in packages as small as 6x6 mm, with support for PCIe and GigE (SGMII).

High-speed Interfaces –  Up to 70% faster differential I/O (vs. similar FPGAs) at 1.5 Gbps. 5 Gbps PCIe, 1.25 Gbps SGMII (GigE) and 1066 Mbps DDR3 memory interfaces also supported.

Built on Lattice Nexus platform –  Up to 4x lower power vs. similar FPGAs. Up to 100x higher reliability, due to 100x lower Soft Error Rate (SER) from 28 nm FD-SOI technology.

Features

•  Up to 39K logic cells, 2.9 Mb embedded memory, 56 18 x 18 multipliers, 192 programmable I/O, one lane of 5 Gbps PCIe, two lanes of 1.25 Gbps SGMII, two ADCs (each 12-bit, 1 MSPS).
•  Packages as small as 6x6 mm, and in ball-pitch options of 0.5 and 0.8 mm.
•  Power modes  –  User selectable Low Power vs. High Performance modes, enabled by FD-SOI   programmable back-bias.
•  Design security  –  ECDSA bitstream authentication, coupled with robust AES-256 encryption.
•  Instant-on configuration  –  I/O configures in 3 ms, and full-device as fast as 8 ms.

Featured Content Section

Product Brief: CERTUS™-NX Reinventing the Low-Power General Purpose FPGA

White Paper: Certus-NX Innovates General-Purpose FPGAs

Lattice mVision Solutions Stack Accelerate Implementation of Low Power Embedded Vision Applications

Build FPGA-Based Processor Systems in Minutes

Product Brief: Predictable FPGA Design Convergence

Product Selector Guide: Ultra-Low Power Lattice sensAI™ Stack

Product Technical Specifications

Search Results

LFD2NX-17
LFD2NX-40

Related Searches

1. general purpose FPGA
2. FD-SOI
3. Lattice Nexus
4. bridging
5. ECP5
6. co-processing
7. motor control

Related Product

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LFD2NX-VERSA-EVN  

Certus-NX Versa Development Board

DS-CONN-ST-U  

ECP5/5G IP Core

LFE5U-12F-8BG256CES  

40nm Technology ECP5 FPGA

 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8542.31.00.60
  • Automotive
    No
  • PPAP
    No
  • Family Name
    Certus-NX
  • Process Technology
    28nm
  • User I/Os
    74
  • Number of I/O Banks
    8
  • Operating Supply Voltage (V)
    1
  • Logic Elements
    39000
  • Number of Multipliers
    56 (18x18)
  • Program Memory Type
    SRAM
  • Embedded Memory (Kbit)
    1512
  • Total Number of Block RAM
    2
  • Maximum Distributed RAM Bits
    245760
  • Device Logic Units
    39000
  • Device Number of DLLs/PLLs
    3
  • Programmability
    Yes
  • Reprogrammability Support
    No
  • Copy Protection
    No
  • In-System Programmability
    No
  • Speed Grade
    7
  • Minimum Operating Supply Voltage (V)
    0.95
  • Maximum Operating Supply Voltage (V)
    1.05
  • I/O Voltage (V)
    1|1.2|1.35|1.5|1.8|2.5|3.3
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    100
  • Supplier Temperature Grade
    Industrial
  • Tradename
    Certus™
  • Mounting
    Surface Mount
  • Package Height
    0.65(Min)
  • Package Width
    14
  • Package Length
    14
  • PCB changed
    256
  • Standard Package Name
    BGA
  • Supplier Package
    CABGA
  • Pin Count
    256
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources