LTM3360B: 5VIN, 33A High-Density Step-Down DC-to-DC μModule Regulator with I2C and Integrated Capacitors
The LTM®3360B is a high-current, high-density, low-voltage buck power µModule® (micromodule) regulator optimized for high-output current applications.
The LTM®3360B’s 2.9V to 5.5V input voltage range accommodates an intermediate bus voltage (IBV) of 5V ±10% or 3.3V ±10%. The current output capability of 33A can be paralleled to provide >1000A in a multiphase, stacked from a main-to-subordinate device configuration. Regulated output voltages down to 0.3V are achieved using a current mode architecture, which is capable of small on-time at very high frequencies. Select an appropriate feedback resistor divider to configure the output voltage. The 0.3V (default) feedback voltage is 8-bit adjustable through an I2C for margining or dynamic voltage scaling. Keep the feedback voltage close to 0.3V for the best phase-margin voltage regulation loop. The high fixed clock frequency of 5MHz which is double the switching frequency of 2.5MHz each phase permits integration of input and output capacitors and a power inductor, resulting in the highest density of output current-to-board footprint achievable in the industry today with minimal external components required. The LTM3360B is offered in a ball grid array (BGA) package, 0.4mm ball pitch, with excellent thermal performance and integrated inductors, input, and output capacitors. The LTM3360B is lead(Pb)-free and RoHS-compliant.
Key Features and Benefits
- Highest Output Current to Total Solution Footprint (1A/mm2), Integrates all CINs, COUTs, and Inductors
- Fast Transient Response
- VIN Range: 2.9V to 5.5V
- VOUT Range: 0.3V to 1V
- Remote Differential Output Sense Pins
- VOUT+ DC accuracy: ±1%
- I2C Serial Interface—Telemetry Readback Includes VOUT, IOUT, VIN, and Die Temperature
- Analog IMON pin for Output Current Monitoring
- Fixed Clock Frequency of 5MHz, External SYNC from 4.5MHz to 5.5MHz
- Parallel Operation: Multiphase up to 12 phases and Stackable to > 1000A
- Advanced Thermally Enhanced 160-Lead, 6.55mm × 5mm × 3.31mm, BGA Package
Applications
- Data Centers xPU Core, Application-Specific
- Integrated Circuit (ASIC), Field-Programmable Gate
- Array (FPGA) Supplies
- Optical Modules
- Industrial and Communications
- Distributed DC Point-of-Load (POL) Power Systems
| Evaluation Board |
| The LTM3360B can be evaluated with the EVAL-LTM3360B-AZ. |
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