From the grid to the xPU, from the joint to the brain: passive and magnetic components empower AI and robotics

As AI server power consumption moves from the kilowatt level to the hundred-kilowatt level, and as humanoid robots and collaborative robots experience an explosion in demand for high power density, high reliability, and miniaturization, power and signal chain design is facing unprecedented challenges. Among these, passive and magnetic components will be key components for applications such as power filtering, decoupling, and EMI suppression. This article will introduce the role played by passive and magnetic components in AI and robotics applications, as well as the stable, efficient, and reliable passive and magnetic solutions provided by the YAGEO Group.

In AI and robotic systems, passive components and magnetic components are the "invisible cornerstone" of the power and signal chain. They do not participate in logic computation, yet they are responsible for power conversion, filtering and decoupling, energy storage and voltage stabilization, resonant conversion, electrical isolation, current sensing, EMI suppression, and surge protection. GPU/CPU power supply for AI servers presents trends of low voltage, high current, high switching frequency, and multiphasing, requiring low ESR/ESL, high capacitance, high saturation, low loss, and high reliability, directly affecting conversion efficiency, power density, thermal design, and computing stability; robots, in joint motor drive, battery management, sensing, and communication, need to balance miniaturization, vibration resistance, high temperature resistance, and long life. Magnetic components undertake transformation, isolation, energy storage, filtering, and detection, and their performance determines system efficiency, signal integrity, safety, and service life. They are an indispensable foundation for AI and robots to achieve efficient, stable, and reliable operation.

The standard products of YAGEO and its subsidiaries (such as Pulse, KEMET, etc.) in AI server and humanoid robot applications mainly revolve around four major functions: power conversion, signal filtering, electromagnetic compatibility (EMC), and power management. For example, in the core power conversion of AI server applications, MAGLASS® molded inductors can be used for DC-DC step-down conversion of GPU/CPU core power supply (such as 12V→0.8V), undertaking energy storage and filtering in multiphase Buck circuits. They use MAGLASS® patented unbalanced alloy powder, have the lowest coercivity, and balance high saturation magnetic flux density with low core loss.
 
YAGEO's inductor products cover molded inductors, using advanced molding processes, high saturation current, low DCR, sizes as small as 1.4 x 1.2mm, thickness as low as 0.65mm, supporting currents up to 300A, suitable for multiphase VRM, TLVR structure supporting fast transient response, and passing AEC-Q200 automotive-grade certification, suitable for harsh environments such as robot joints.
 
Wire-wound inductors use a wire-wound structure, have high Q value and low parasitic capacitance, and are suitable for RF and high-frequency applications. Sizes cover 0.6 x 0.3mm ~ 5.0 x 6.4mm, Q value up to 105, suitable for antenna matching and filtering, low DCR, low loss, and can improve signal integrity. Multilayer inductors use ceramic/ferrite materials and multilayer laminated structures, with sizes as small as 0.6 x 0.3mm, suitable for high-frequency, low-power scenarios, stable inductance values, and suitable for RF modules and sensors.
 
Common mode chokes have high impedance and wideband suppression characteristics, with sizes from 1.6 x 0.8mm ~ 15 x 13mm, SRF >500kHz, current up to 40Arms, suitable for CAN-FD, Ethernet, USB and other interfaces, meeting IEEE802.3 and IEC6228-3 standards. Power beads use ferrite materials, multi-band noise suppression, sizes from 0.6 x 0.3mm ~ 8.5 x 3.0mm, wide impedance range, suitable for power lines and signal lines, with significant high-frequency noise suppression effects.
 
In addition, multiphase coupled and TLVR inductors can be used for multiphase VRM of AI server GPU/CPU, achieving fast transient response and high current output, such as the BDKK series (molded TLVR), BMYI/BMUx (2-in-1), PGL725/PGL727 (2/3/4-phase coupled). Power beads and EMI filtering can be used for EMI suppression of power input terminals, signal lines, and clock lines, such as BMBx/APMx/BPMV power beads, sizes from 0402 to 1210, current up to tens of amperes, AWCU series common mode inductors for CAN-FD, EtherCAT, USB and other interfaces, impedance range 10Ω ~ 1000Ω, rated current 70 ~ 360mA.
 
On the other hand, vertical power delivery (VPD) and future modules can adapt to the vertical power supply trend of AI chips, shorten current paths, reduce voltage drop and parasitic inductance, and provide customized solutions such as TLVR, coupled inductors, and power modules, such as 4-in-1 L x 2 pcs/module, 9.6 x 2.4 x 2.78mm molded modules, supporting ferrite or metal material customization to meet different circuit designs.
 
In humanoid robot applications, joint motor drive power can use common mode inductors and power inductors for 48V bus input, suppressing motor PWM common mode noise, ensuring stable CAN-FD communication. The AWCU series common mode inductors support 51µH ~ 100µH, impedance ≥300Ω@100MHz, DCR<10Ω, SRF>30MHz, core material is manganese-zinc ferrite, avoiding the problem of poor low-frequency suppression of nickel-zinc.
 
Multilevel DC-DC conversion can use power inductors for 48V→24V/12V/5V/3.3V multilevel step-down, supplying driver chips, encoders, MCU/FPGA, etc. L1 supports 50 ~ 1500W power levels, current 6 ~ 30A, common mode inductance 0.4 ~ 2.2mH, DCR as low as ≤6mΩ, L2 ~ L5 respectively correspond to 48V→24V, 48V→12V, 12V→5V, 5V→3.3V, inductance values from 0.22µH to 3.3µH, saturation current 3A ~ 65A.
 
In signal and interface filtering applications, common mode inductors and POC inductors can be used for EMC filtering of signal lines such as CAN-FD, Ethernet, and GMSL coaxial cameras. The AWCU series has sizes 3225/4532, inductance 10 ~ 1000µH, DCR 0.4 ~ 5.5Ω, Irms 70 ~ 360mA. POC inductors are used for coaxial camera power supply, sizes 2.0 x 1.2 x 1.6mm ~ 4.5 x 3.2 x 3.5mm, inductance 0.47 ~ 22µH, current 0.3 ~ 1.1A.
 
In computing and sensing modules, power inductors and beads can be used for CPU/GPU/SOC core power supply, DDR5 memory, and sensor modules, such as BDQQ/BDYY molded inductors, BKPx multilayer inductors, sizes as small as 1.0 x 0.5mm, BPMx/APMx power beads for power line noise suppression, supporting AEC-Q200 automotive-grade reliability, adapting to robot vibration and temperature changes.
 
Through MAGLASS® material technology, molding/multilayer/wire-wound processes, and automotive-grade quality, YAGEO provides AI and robotics with a comprehensive passive component solution from power conversion and EMI filtering to signal integrity. These products jointly support the needs of AI and robotic systems in high power, high frequency, and high reliability, helping to realize a smarter and more efficient future.
 
The YAGEO Group also develops custom and catalog power magnetic products. AI applications use internally developed advanced materials. Products cover single power beads, TLVR, coupled inductors, power inductors including open-gap ferrite, molded cores, composite cores, drum/shielded cores, as well as common mode chokes, current sense transformers, isolation/gate drive transformers, power transformers, and provides customized solutions from mW to kW, using advanced magnetic materials, backed by more than 80 years of ferrite and powder experience, and supports advanced simulation such as magnetic, thermal, and mechanical (Ansys). Magnetic products are manufactured in 7 regions worldwide, with supply resilience.

YAGEO's R-Chip (chip resistor) products in AI servers and extendable robot applications mainly undertake tasks such as anti-sulfur and anti-corrosion, current sensing, precision voltage division/feedback, high-power shunting, and reliable operation under high humidity and high temperature. AI servers have the characteristics of high unit price, long life, and unpredictable deployment environments, and their price can reach 20 ~ 30 times that of traditional servers, so the reliability requirements for passive components are extremely high.
 
R-Chip is mainly used in power management, such as GPU/CPU core power supply, DC-DC conversion, BMS/BDU, power distribution units, as well as overcurrent detection of GPU modules, power shelves, NVLink switch trays, and signal conditioning for low-speed signals, precision voltage division, and feedback loops, and can prevent sulfur-containing gases from reacting with silver electrodes to form Ag₂S, causing open-circuit failure, and supports anti-pulse/high power, coping with GPU load transients, surges, and high temperatures.
 
The R-Chip product series is quite broad, covering Anti-Sulfur Thick Film AF series, which has the largest usage in AI servers, used for anti-corrosion and general-purpose resistors, passing AEC-Q200 certification, PPAP ready. High Moisture Resistant Thin Film RP series can be used for precision voltage/current monitoring, low-voltage signals, and long-life scenarios, with long-term stability in high-humidity environments, epoxy coating + passivation layer, and stable results after 8,000 hours of life testing.
 
Metal current sensor PA series is used for overcurrent monitoring, battery management, and power supply, sizes 0100 ~ 2512, resistance 0.5mΩ ~ 20mΩ, lead-free, no RoHS exemption, TCR as low as 50 ppm/°C. Metal current sensor PS series uses a 4-terminal Kelvin design, can be used for high-precision current detection, eliminating the influence of pin resistance, sizes 0100 ~ 4527, resistance up to 1Ω.
 
Shunt current sensor PW/PU series can be used for high-current shunt detection, BMS/BDU, automotive, energy, power up to 15W (PW2512/3921/5931), current up to 150A, resistance as low as 0.1mΩ (3921). Anti-pulse high-power AS series has surge resistance, pulse resistance, and high power characteristics, such as 1206-1W, 0805-0.5W, 0603-0.33W, 0402-0.2W, supporting AEC-Q200, anti-FOS. High-temperature AG series is suitable for high temperature + sulfur-containing environments, and can be used in AI servers and near robot joints.
 
The core value of YAGEO R-Chip in AI and robot applications is mainly reflected in the requirements of anti-sulfur and anti-corrosion, precision monitoring, high-current detection, high reliability, and high usage. These characteristics make YAGEO R-Chip an indispensable basic component in AI server and robot power, current detection, and signal chains.

YAGEO's MLCC (multilayer ceramic capacitors) in AI servers, AI PC, robots, autonomous driving, industrial automation and other applications mainly undertake key functions such as stable power supply, decoupling/filtering, EMI suppression, high-voltage resonance, signal matching, and safety isolation.
 
In AI and robotic systems, MLCC can provide decoupling and smoothing for CPU, GPU, DDR, FPGA, and ASIC, reducing ripple and noise, and can be used for power conversion in AC-DC, DC-DC, PFC, LLC resonance, 48V/800V HVDC architectures, and can also be used for EMI suppression of power input, signal lines, and communication interfaces, meeting safety and EMC requirements.
 
In addition, MLCC can also help maintain resonant tuning accuracy in 800V SiC/GaN power stages, and is used for matching, DC blocking, and bypassing in 5G, WiFi, Bluetooth, radar, and LiDAR. Soft terminals can resist board bending cracks, adapt to robot joints and automotive vibration environments, and have mechanical reliability. X8G/X8R, etc. support 150°C for high-temperature scenarios such as near motors and under the hood.
 
Key MLCC products in AI applications include high-voltage NPO (HV NPO), which can be used for 800V DC backbone, DC/DC isolation and resonant LLC, low-pass filtering, and snubber, size 1210, voltage 630V / 1kV / 1.25kV / 1.5kV, capacitance 10nF / 22nF / 33nF, capacitance changes very little with temperature and time, no aging drift, suitable for precise resonant tuning.
 
High-capacitance MLCC (High Cap) can be used for GPU/CPU/DDR decoupling and filtering, including X5R, X6S, X7R, X5S series, using thin dielectric + multilayer, fine powder, large effective area, high dielectric constant (εr > 4800), core-shell structure, low nickel electrode, and high stacking continuity technology.
 
Full capacitance SC/ST series are used for AC-DC input EMI filtering and safety isolation, passing UL/TUV certification, X1/Y2, X2 safety capacitor classification standards, rated 250VAC, withstand voltage 1500VAC, pulse 5kV (X1/Y2) / 2.5kV (X2), capacitance 100pF ~ 5.6nF, sizes 1808/1812/2211/2220.
 
High-frequency RF MLCC (CQ/AQ) is used for 5G base stations, WiFi, mobile phones, automotive antennas, and radar, with CQ general grade/AQ automotive grade, NPO dielectric, sizes 01005 ~ 0805, capacitance 0.1pF ~ 100pF, voltage 16V ~ 500V, low ESR, high Q, low ESL, suitable for DC blocking, impedance matching, and bypass.
 
Embedded MLCC (CE series) is used for high-density decoupling, sizes 0201 / 0402, thickness 0.13±0.02mm / 0.2±0.02mm, voltage 4V ~ 25V, capacitance 10nF ~ 200nF, can be embedded in PCB, shortening current paths, reducing parasitic inductance, improving low-impedance bandwidth and power integrity, suitable for AI PC, 5G equipment, and high-density modules.
 
Soft terminal and automotive-grade (AS/AC/AQ) series, including soft terminal AS/ST with bending strength minimum 5mm, epoxy resin + optimized glass transition, high solid content, low ESR. Automotive-grade AC/AQ series pass AEC-Q200, suitable for OBC, BMS, DC-DC, ADAS/LiDAR, infotainment. High-temperature X8G/X8R series support -55°C ~ 150°C, 0603 ~ 0805, 16V ~ 100V, 680pF ~ 100nF, for under-hood, transient suppression, and safety circuits.
 
The core characteristics of YAGEO MLCC in AI and robot applications include high reliability, high capacitance, high voltage, high frequency, low ESR, bending resistance, high temperature resistance, miniaturization, and embedding. Through a complete product portfolio and global capacity, YAGEO has become a key passive component supplier in the fields of AI and robot power, signal, and EMI.

YAGEO Group (including KEMET) tantalum capacitor products mainly include KO-CAP® polymer tantalum capacitors, AO-CAP®, and MnO₂ tantalum capacitors. In AI server and robot applications, they mainly undertake key tasks such as power decoupling, filtering, energy storage, transient response, and voltage stabilization, and can extend to high-reliability, high-power-density scenarios for robots.
 
AI server GPU/CPU power consumption has risen from the 10kW level to the 100kW level, with many voltage rails, high switching frequency, and large transient currents. Tantalum capacitors are mainly used for GPU/CPU core power supply, LPDDR5 memory power supply, as well as chipset / BMC / M.2 SSD / USB 3.0, 12V intermediate bus / PCIe / DDR5 / NIC / DPU / Hot-Swap, AC/DC input and 48V intermediate bus.
 
The core advantages of polymer SMD tantalum capacitors include ultra-low ESR, 3mΩ ~ 70mΩ, suitable for high-frequency switching and transient response, non-ignition failure mode with high safety, surface mount, solid counter electrode with no dry-out risk, low capacitance loss at high frequency suitable for 400kHz ~ 4MHz switching, no voltage derating, more flexible design margin, T599 supports 150°C AEC-Q200; T525/T530/T598 support 125°C, support low DC leakage, self-healing mechanism, 100% accelerated steady-state aging + 100% surge current testing, with EIA standard sizes, automotive/high-reliability series, and high-voltage series.
 
The core value of YAGEO/KEMET tantalum capacitors (KO-CAP polymer tantalum, AO-CAP, etc.) in AI and robots includes stabilizing AI power, providing low-ESR, large-capacitance decoupling and filtering for GPU/CPU, LPDDR5, chipset, BMC, SSD, PCIe, DDR5, NIC/DPU, supporting high voltage/high frequency, high reliability and long life, miniaturization and high density, safety and environmental protection. These characteristics make YAGEO tantalum capacitors an indispensable high-performance passive component in AI server and robot power systems.

YAGEO's film capacitors in AI server power chains and robot (industrial/automotive) power and drive mainly handle key tasks such as AC filtering, PFC, DC-Link voltage stabilization, resonance, snubber/surge suppression, SST solid-state transformers, and inverter output filtering.
 
Traditional data centers, due to multiple conversion stages and low-voltage high-current, have end-to-end efficiency of only about 87.6%. Next-generation architectures are moving toward 50V servers, 800V native servers, HVDC side-rack, and SST, and the demand for film capacitors will increase accordingly.
 
The specific functions of film capacitors include AC/DC, DC/DC filtering and stabilization, SST, power factor correction (PFC), surge suppression, inverter and switching stage snubber, coupling and decoupling, renewable energy and UPS, resonant circuits, and cooling systems.
 
In the SST three-stage modular architecture, film capacitors can be used in the first stage HVAC/DC (modular series-connected rectifier), the second stage DC/DC high-frequency isolation (DAB Cell), and the third stage LVDC/AC and DC/DC multi-port output. Film capacitors are used for AC filtering, DC-Link, and high-frequency isolation.
 
YAGEO film capacitor key product series include C4AQ, C4AQ-M, C4AU, C4AQ-P, C4AK, C4AF, with common advantages including self-healing capability, high ripple current, low loss, low ESL, high reliability, long life, optimized AC voltage performance, suitable for high frequency (SiC, IGBT), AEC-Q200, and THB harsh environments.
 
Robots and AI servers also require high-efficiency, high-power-density, and high-reliability power conversion. Film capacitors play a key role in motor drive inverters, AC filtering, DC-Link, PFC, and UPS. The core value of YAGEO film capacitors in AI and robot applications is SiC/GaN high frequency, high power density, HVDC, liquid cooling, and renewable energy. Film capacitors are key components for stable power supply and efficiency improvement.

The competition in AI and robotics appears to be computing power and algorithms, but at the bottom it is power integrity, signal integrity, and the reliability of passive components. With cross-brand, cross-technology, and cross-region integration capabilities, from material research and development to customized design, from standard products to automotive-grade, high-temperature, high-voltage, and high-frequency solutions, YAGEO continues to build the cornerstone of "Built into Tomorrow" for AI servers and robots. In the future, with the popularization of 800V HVDC, vertical power delivery, embedded power, and higher-frequency switching, YAGEO's passive and magnetic components will continue to play an indispensable key role.