Playing the role of a transformative electric power hub: the solid-state transformer
In the power delivery chain from grid to chip, the Solid-State Transformer (SST) plays the core role of a "transformative power hub." It is not merely an upgraded version of the traditional transformer, but rather the cornerstone of the next-generation AI data center (AIDC) power architecture, regarded by industry leaders such as NVIDIA as the "ultimate power solution."
To understand the SST, one must first clarify its essential differences from the traditional transformer. The traditional transformer is based on the principle of electromagnetic induction and is an "iron lump" that operates at line frequency (50/60Hz). It has a single function - only voltage transformation - and is bulky. The Solid-State Transformer (SST), in contrast, is a sophisticated power electronics system composed of power semiconductor devices (such as silicon carbide, SiC and gallium nitride, GaN) and a high-frequency transformer. Through high-frequency (typically 5–50kHz) conversion technology, it achieves a qualitative leap in power conversion. Therefore, the SST is no longer a simple passive component, but a programmable "intelligent power interface" that can actively manage and optimize electrical energy.
The role of the SST in 800V data center architecture is disruptive, enabling "medium-voltage direct step-down" and greatly streamlining the power chain. The traditional power delivery chain from 10kV medium voltage to server cabinets requires multiple stages of equipment - step-down transformers, UPS, power distribution units, etc. - with numerous conversion stages and low efficiency. The core value of the SST lies in its ability to directly convert 10kV to 13.8kV medium-voltage AC into 800V DC, significantly simplifying the original 2–3 levels of redundant power stages, making the power delivery chain unprecedentedly concise and efficient.
With the development of large AI models, data centers are facing the severe challenge of cabinet power leaping from kW-level to MW-level. The emergence of the SST provides a critical path to address the following core pain points, including efficiency leap, space revolution, deployment agility, millisecond-level dynamic response, and modular redundant design. Paired with third-generation semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN), it further enhances efficiency and power density.
Solid-state transformer: the starting point of the 800VDC architecture
The solid-state transformer is the starting point of the 800VDC architecture and the first step from traditional AC distribution toward high-voltage DC. Traditional power architectures require multiple stages of AC/DC and DC/DC conversion, with each stage incurring energy losses. The emergence of the solid-state transformer (SST) changes this situation by directly converting 10kV to 13.8kV medium-voltage AC into 800V DC, greatly simplifying the power delivery chain and reducing copper losses.
Current SST technology has already demonstrated impressive efficiency performance, with the latest SSTs achieving energy conversion efficiencies of over 98.5%. When using silicon carbide (SiC) technology and implemented in 2–5MW modular building blocks, it can support hyperscale data center deployments. At the PCIM Asia 2026 booth, we will demonstrate how the SST serves as the "first kilometer" of the entire 800VDC power architecture, enabling medium-voltage direct feed, chain simplification, and maximized energy efficiency.
In the 800VDC data center architecture, from the high-voltage DC bus to the GPU motherboard, a large number of reliable, high-efficiency connection points are required. The COEUR Socket Display Board from Molex showcases the COEUR socket technology, which is precisely the core technical solution addressing the challenges of high-voltage, high-current interconnections. Within the complete chain of the 800VDC architecture, COEUR socket technology plays the role of a "high-current interconnect cornerstone." From the grid to the chip, every segment of the high-voltage DC link requires low-resistance, high-reliability, and high-density connection solutions to ensure that power reaches the GPU with minimal loss - this is precisely where the value of COEUR socket technology lies.
Click here to view related information
Within the complete chain of the 800VDC architecture, Molex's Sentrality interconnect system plays the key role of a "high-density, high-reliability power interconnect node." It is not merely about transmitting power; it is a core solution to the challenges of mechanical tolerance accumulation and space constraints in high-power systems. Sentrality can serve as a central power distribution node and covers multiple connection scenarios. With its low contact resistance from COEUR socket technology, self-alignment capability from OmniGlide technology, and a compact height of only 10.00mm, Sentrality ensures that megawatt-level power reaches every compute node with minimal loss and maximum reliability.
Click here to view related information
In the 800VDC architecture, onsemi's medium-voltage system solutions, particularly its solid-state transformer (SST) related technologies, play the most front-end and critical "voltage transformation and conversion hub" role in the "grid-to-chip" power delivery chain. onsemi's "Medium-Voltage System Solutions" showcase not just individual products, but a complete foundation for an 800V DC power ecosystem starting from the grid side. Through advanced SiC MOSFET technology, complete system-level solutions, and intelligent control capabilities, onsemi - together with partners like NVIDIA - paves the way for AI factories toward higher efficiency, higher power density, and more sustainable development.
Click here to download related information
In the 800VDC architecture, YAGEO's C4AF series DC-link capacitors play the core roles of "power stabilizer" and "noise filter." They are the critical components that ensure the 800V DC output from the solid-state transformer (SST) is smooth and clean, thereby reliably driving the high-power GPUs downstream. The C4AF capacitor is located at the key node of the 800VDC power delivery chain - the DC-Link - and primarily functions to stabilize bus voltage, filter high-frequency noise, and provide transient power. Its high voltage, high current, extremely low ESR, and AEC-Q200 grade reliability make it a solid backbone supporting the stable operation of the immense computing power in AI factories.
Click here to view related information
In the 800VDC architecture, YAGEO's PGT6541NLT high-isolation transformer plays the core roles of "safety barrier" and "signal/power isolated transmission." Control circuits and drive circuits typically operate in a low-voltage domain far below 800V. The function of the PGT6541NLT transformer is to provide electrical isolation, safety protection, and signal/power coupling, ensuring system functional safety and electromagnetic compatibility (EMC). With its isolation voltage of up to 4400Vrms, a creepage distance of 22mm, and reinforced insulation certification, the PGT6541NLT establishes a reliable safety barrier between the high-voltage power side and the low-voltage control side, ensuring reliable transmission of drive signals and auxiliary power.
Click here to download related information
Article tags
