iMX93 EVK by eInfochips
The EIC- i.MX93-210 is an RDP based on the i.MX93 application processors. The processor features a scalable Arm Ethos™-U65 microNPU Core for efficient machine learning acceleration, as well as advanced security with an integrated EdgeLock secure enclave to support edge computing. The RDP enables developers to begin creating high-performance, cost-effective, and energy-efficient machine-learning applications. Wi-Fi, Bluetooth, Gigabit Ethernet, CAN, and 3G/4G/LTE connectivity via a Mezzanine Card are all available. The kit includes pre-integrated Linux, making it an excellent choice for applications such as industrial automation, smart home & intelligent appliances, smart buildings, and automotive.
Specification
CPU Name - NXP i.MX93
CPU Type - Two Cortex®-A55 processors operating up to 1.7 GHz.
Memory
LPDDR4 : 1x 2GB LPDDR4x RAM
eMMC : 1x 16GB eMMC 5.1
SDIO : 1x SDIO 3.0 interface (mux with WLAN)
Micro-SD card : 1x SD Card 3.0 interface
Connectivity
Wi-Fi
• AWCM276NF – IEEE 802.11 a/b/g/n/ac, 2.4/5.0 GHz
• 2x MHF4 antenna connector
• Matter 1.0 Ready
Bluetooth - Bluetooth 5.3 compliant with Bluetooth 2.1 + Enhanced Data Rate (EDR)
USB - 1x USB2.0 with DRP / 1x USB2.0 Host mode Only
Ethernet - 1x RGMI Interface
Display
DSI - 1x 4-Lane MIPI DSI v1.2 interface
LVDS - 1x 4-Lane LVDS
HDMI - 1x HDMI interface (Mux)
Camera
CSI - 2 Lane MIPI CSI-2 v1.2 interface
RGB - 8-bit RGB interface (Mux)
Audio
CSI - 3x SAI / 1x PDM
Sensors
Sensors - 1x 4 channel current sensor
Other
• 1x CAN Interface
• 3x UART, 4x I2C, 2x SPI, 4x ADC,GPIOs
• 1x Reset Switch, 1x ON/OFF Switch
Power specifications
SOM - SOM: 3.8V to 5.5V (Typ. 5V)
Carrier (Kit) - 10.8V to 13.2V (Typ. 12V)
Mechanical specifications
SOM - 65mm x 55mm
Carrier (Kit) - 85mm x 100mm
OS SUPPORT
OS - Linux
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