SpeedVal Kit™ + Molex Interconnect: reducing development time and increasing quality
The SpeedVal Kit™ evaluation platform is an integrated solution using proven parts from top manufacturers. Molex lends its expertise in interconnect technology by supplying connectors, cable assemblies, and busbars to the SpeedVal project. The secure contacts provided by these components enable modularity and flexibility.
Industry Partnership
The Wolfspeed SpeedVal Kit™ modular evaluation platform enables developers quickly test and optimize the performance of Wolfspeed Silicon Carbide MOSFETs. The card-edge board connection helps users swap SiC devices in seconds, leading to significantly reduced development cycle times. This configuration allows for the testing of many types of devices, from surface-mount TOLL through TO-247. Read on to learn more about the precision interconnect components found on the SpeedVal system.
More Power Solutions from Molex
Connectors:
Sentrality Pin and Socket Interconnect System
Molex’s Sentrality Pin and Socket Interconnect System offers high-current board-to-board, busbar-to-board and busbar-to-busbar connectors and provides a +/- 1.00mm radial self-alignment to overcome tolerance stack-up issues.
COEUR Socket Technology Power Connectors
Customers require high-power connectors that support a wide range of design and manufacturing solutions. To meet these needs, Molex has developed interconnects that package our COEUR sockets in various configurations, including mezzanine style board-to-board and board-to-busbar designs, wire-to-board and wire-to-busbar designs, as well as panel-to-board and panel-to-busbar designs.
PowerPlane Busbar Power Connectors
PowerPlane Busbar Power Connectors deliver high-current performance along with various configurations and feature options, making them applicable for a wide range of power-distribution applications.
EXTreme Power Products Digital Product Board:
EXTreme LPHPower
- Current Rating: 30.0A / Blade 50.0A / cm Prole Height: 7.50mm Voltage (max): 250V
EXTreme Ten60Power
- Current Rating: 60.0A /
- Blade 109.0A / cm
- Prole Height: 10.00mm Voltage (max): 600V
EXTreme Guardian
- Board-to-Board
- Current Rating: 80.0A / Blade 155.0A / cm
- Prole Height: 12.74mm
- Voltage (max): 120V
- Wire-to-Board
- Current Rating: 80.0A / Blade 73.0A / c
- Prole Height: 17.60mm
- Voltage (max): 600V
EXTreme EnergetiC
- Current Rating: 100.0A / Blade 130.0A / cm
- Prole Height: 16.90mm Voltage (max): 320V
EXTreme PowerMass
- Current Rating: 150.0A /
- Blade 150.0A / cm
- Prole Height: 25.90mm Voltage (max): 600
Cable Assemblies:
Off-The-Shelf Cable Assemblies Product Reference Guide: Consumer and Commercial Solutions
- Early Design
Off-The-Shelf cable assemblies and pre-crimped leads allow engineers to quickly pin out cable assemblies and test systems in days without the hassles of crimping and poking wire. - Custom Design Revision
The cable assembly Design Guide and Custom Cable Creator allows customers to design the right length, pin-out, bundling and wire type to move into production by selecting an optimized bill of materials. - Mass Production
Molex’s industry-certified manufacturing plants support your design manufacturing from early production to high-volume, fully automated assembly based on your program requirements.
Off-The-Shelf (OTS) Discrete Wire Cable Assemblies Application Brief
Molex provides a complete off-the-shelf cable solution, saving customers tooling costs, expediting development cycles and adding convenience to the purchasing process.
Off-the-Shelf (OTS) EXTreme Guardian Overmolded Cable Assemblies
Off-the-Shelf (OTS) EXTreme Guardian Overmolded Assemblies with locking screw are available in 2- and 3-circuit sizes.
High-Power Cable Assemblies
High-Power Cable Assemblies offer discrete wires or overmolded cables from 6 to 12 AWG and deliver 30.0 to 80.0A current ratings.
BusBars / Sentrality:
Molex Busbar Solutions Brochure
Busbars are the backbone of power distribution. Molex applies its decades of Busbar experience to partner with customers, providing feedback on their designs, recommending solutions, prototyping and more. By working so closely with customers, we strive for the following goals.
Sentrality Pin and Socket Interconnect System
Power efficiency is critical to cost and safety management in power- intensive applications, such as power transmission systems in data centers, base stations, battery management, inverters, etc. Sentrality High-Current Pin and Socket Interconnects incorporate Molex’s proven COEUR sockets, which have multiple contact beams to create a large contact surface at the contact interface, resulting in very low contact resistance. The voltage drop across the contact interface is therefore very low, which leads to minimal heat generation.
It is challenging to align sockets and pins when mating parallel PCBs or busbars, due to tolerance stack-up issues inherent in any mechanical design. A degree of self-alignment is valuable to gather the connectors during mating and mitigate any misalignment. Sentrality High-Current Pin and Socket Interconnects, incorporating Molex’s proprietary OmniGlide technology, provide up to 1.00mm of radial self-alignment (industry leading). This minimizes potential damage to the connectors and specifically the socket’s contact beams during mating.
Dense electronic packaging demands low stack heights between mated substrates and the ability to easily customize connector profiles to optimize connector protrusions above the top substrate and below the bottom substrate. Sentrality High-Current Pin and Socket Interconnects are only 10.00mm tall, regardless of pin size. The position of the socket flange (that rests on the PCB) can be easily customized for customer applications to optimize protrusion beyond the top or bottom of the substrates.
Introducing Wolfspeed's SpeedVal Kit™
Speed up the transition from silicon to silicon carbide with the industry's most versatile evaluation platform.
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