The amount of data movement every day is nothing short of staggering. With skyrocketing adoption rates of both AI and 5G technologies, the ability to efficiently process and transfer massive quantities of data will involve numerous technological innovations. In this article from KEMET, get an overview of the subsystems that comprise telecommunications and data infrastructure.
As the push for AI technologies continues, our dependence on data centers continues to grow. Large data centers consume as much electricity as small towns and require many different systems to be in place to operate. Looking specifically at 5G networks, let’s take a deep dive into the subsystems that make up telecommunications.
Telecommunication systems comprise of the following components.
- Mobile Devices – These are all of the devices individuals currently use to connect to networks.
- Cell Site – These are the cell towers and base stations that are used as boosters along the communication network. They are made up of antennas, radio units, and baseband processing units.
- Backhaul – This is the physical connection between each cell site and the network. This is explained in greater detail below.
- Data Center (Core Network) – This facility handles network functions, comprised of switches, routing, authentication, and can contain databases of information.
- External Networks – These are additional data sources and services, that the data center uses to access additional information for web content.
The backhaul system uses the following to make connections throughout the network.
- Fiber Optics – High capacity and low latency lines but have to be physically installed.
- Microwave Links – Wireless communication using microwave frequencies. Typically used over shorter distances.
- Satellite Links – In more remote areas, satellite links can connect to the greater system.
- Ethernet and IP/MPLS Networks – Wired networks using ethernet cables to make connections.
At YAGEO Group, we offer a wide range of products that support these systems. Specifically, when designing datacenters and server operations, the solid polymer V-Chip & Crown Radial SMD are used for capacitor applications inside these systems.
Solid Polymer V-chip
- No electrolyte to dry out
- Stable capacitance over time & at high frequencies
- Low and stable ESR over time
- High ripple current capability
- Long life
- Very good low-temp performance
- Multiple specialized series: low leakage, high ripple current, long life
- Short lead time versus the market
Crown Radial SMD
- AEC-Q200 qualified
- 25V – 63V
- 20g vibration
- High temp: 125°C, 150°C, 165°C series
- Ripple current: up to 28A RMS
- High Energy Density
- SMD Option: up to 2x reflow; built-in heat-sink; 20g vibration without “clamping by the body”
- Hybrid polymer series: SMD options coming in 2024
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Aluminum Polymer Hybrid Capacitors