Advanced Thermal SolutionsATS-52150G-C1-R0Heat Sinks

The ATS-52150G-C1-R0 is a heatsink designed for use with BGA packages commonly found on FPGAs, ASICs, and SoCs. The passive heatsink has a thermal resistance of 11.7°C/W. It is constructed with extruded aluminium and features a blue anodized finish. The ATS-52150G-C1-R0 has a thermal tape adhesive to eliminate the need for thermal paste and the whole design is RoHS-6– and REACH-compliant, making the heatsink applicable in the EU market. It is 15 mm wide, 15 mm long, and has a height of 12.5 mm.

Drawings/Package

Key Features

- Blue anodized finish

-Passive heatsink for BGA packages

-Self-adhesive thermal layer

-RoHS-compliant

General Applications

-FPGAs

-SoCs

-ASICs