Winbond ElectronicsW71NW11GC1DWMulti-Chip Package Memory
MCP 64Mx16 Flash + 32Mx16 DDR DRAM 1.8V 130-Pin VFBGA
| Compliant | |
| 3A991b.1.a. | |
| Unconfirmed | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| 1G | |
| 512M | |
| 64Mx16 Flash + 32Mx16 DDR DRAM | |
| Yes | |
| 1.7 | |
| 1.95 | |
| -40 | |
| 85 | |
| Industrial | |
| Mounting | Surface Mount |
| Package Height | 0.68 mm |
| Package Width | 8 mm |
| Package Length | 9 mm |
| PCB changed | 130 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| 130 |
| EDA / CAD Models |
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