Winbond ElectronicsW632GU6NB11IDRAM 芯片
DRAM Chip DDR3L SDRAM 2Gbit 128Mx16 1.35V 96-Pin VFBGA
| Compliant | |
| EAR99 | |
| Obsolete | |
| 8542.32.00.36 | |
| Automotive | No |
| PPAP | No |
| DDR3L SDRAM | |
| 2G | |
| 128Mx16 | |
| 8 | |
| 16M | |
| 16 | |
| 16 | |
| 933 | |
| 0.195 | |
| 17 | |
| 1.283 | |
| 1.45 | |
| 235 | |
| -40 | |
| 95 | |
| Industrial | |
| 16 | |
| Mounting | Surface Mount |
| Package Height | 0.6(Max) mm |
| Package Width | 7.5 mm |
| Package Length | 13 mm |
| PCB changed | 96 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| 96 | |
| Lead Shape | Ball |
| EDA / CAD Models |
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