| Compliant | |
| EAR99 | |
| Active | |
| COMPONENTS | |
| Automotive | No |
| PPAP | No |
| Cascadable Amplifier | |
| 1 | |
| 750 | |
| 15.6@350MHz | |
| 20.6@350MHz | |
| 35@350MHz | |
| 20(Typ)@350MHz | |
| 19.7(Typ)@350MHz | |
| 15.1(Typ)@350MHz | |
| 4@350MHz | |
| 5 | |
| 2.7 | |
| 3 | |
| 100(Typ) | |
| Single | |
| 1100 | |
| -40 | |
| 85 | |
| Tape and Reel | |
| Mounting | Surface Mount |
| Package Height | 0.95(Max) |
| Package Width | 2.1(Max) |
| Package Length | 2.1(Max) |
| PCB changed | 6 |
| Standard Package Name | SON |
| Supplier Package | VSON EP |
| 6 | |
| Lead Shape | No Lead |
This cascadable amplifier THS9000DRWT buffer amplifier, developed by Texas Instruments, will adjust an RF signal to meet your project's specifications. Its maximum power dissipation is 1100 mW. This RF amplifier chip has a temperature range of -40 °C to 85 °C. In order to ensure safe delivery and enable quick mounting of this component after delivery, it will be encased in tape and reel packaging during shipment. It has a single channel per chip. This device uses a single power supply.
| EDA / CAD Models |
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