| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | 3A991.b.1.a |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.32.00.71 |
| Automotive | Unknown |
| PPAP | Unknown |
| Cell Type | NAND |
| Chip Density (bit) | 2G |
| Architecture | Sectored |
| Boot Block | No |
| Block Organization | Symmetrical |
| Address Width (bit) | 29 |
| Sector Size | 128Kbyte x 2048 |
| Page Size | 2Kbyte |
| Number of Bits/Word (bit) | 8 |
| Number of Words | 256M |
| Programmability | Yes |
| Timing Type | Asynchronous |
| Maximum Erase Time (s) | 0.005/Block |
| Maximum Programming Time (ms) | 0.7 |
| Process Technology | 24nm |
| Interface Type | Parallel |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Programming Voltage (V) | 2.7 to 3.6 |
| Operating Current (mA) | 30 |
| Program Current (mA) | 30 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Command Compatible | No |
| ECC Support | Yes |
| Support of Page Mode | Yes |
| Mounting | Surface Mount |
| Package Height | 0.7(Max) |
| Package Width | 9 |
| Package Length | 11 |
| PCB changed | 63 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| Pin Count | 63 |
| Lead Shape | Ball |
