| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8541.29.00.95 |
| Automotive | No |
| PPAP | No |
| 产品类别 | Power MOSFET |
| Configuration | Single Quad Drain |
| Process Technology | 0.18um |
| Channel Mode | Enhancement |
| Channel Type | N |
| Number of Elements per Chip | 1 |
| Maximum Drain-Source Voltage (V) | 20 |
| Maximum Gate-Source Voltage (V) | ±20 |
| Maximum Gate Threshold Voltage (V) | 2.5 |
| Maximum Continuous Drain Current (A) | 25 |
| Maximum Gate-Source Leakage Current (nA) | 30000 |
| Maximum IDSS (uA) | 10 |
| Maximum Drain-Source Resistance (mOhm) | 9.5@10V |
| Typical Gate Charge @ Vgs (nC) | 13@10V |
| Typical Gate Charge @ 10V (nC) | 13 |
| Typical Input Capacitance @ Vds (pF) | 620 |
| Maximum Power Dissipation (mW) | 3500 |
| Typical Fall Time (ns) | 20 |
| Typical Rise Time (ns) | 73 |
| Typical Turn-Off Delay Time (ns) | 12 |
| Typical Turn-On Delay Time (ns) | 15 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 150 |
| Packaging | Tape and Reel |
| Maximum Positive Gate-Source Voltage (V) | 20 |
| Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 15.1 |
| Maximum Power Dissipation on PCB @ TC=25°C (W) | 3.5 |
| Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 80 |
| Typical Diode Forward Voltage (V) | 0.8 |
| Typical Gate Plateau Voltage (V) | 2.2 |
| Typical Reverse Recovery Time (ns) | 22 |
| Maximum Diode Forward Voltage (V) | 1.2 |
| Minimum Gate Resistance (Ohm) | 0.2 |
| Maximum Gate Resistance (Ohm) | 1.8 |
| Mounting | Surface Mount |
| Package Height | 0.75(Max) |
| Package Width | 2.05 |
| Package Length | 2.05 |
| PCB changed | 6 |
| Supplier Package | PowerPAK SC-70 |
| Pin Count | 6 |
