Infineon Technologies AGS71KL512SC0BHV000Multi-Chip Package Memory
MCP 64Mx8 Flash + 8Mx8 DDR DRAM 3V 24-Pin FBGA Tray
| Compliant | |
| 3A991.b.1.a | |
| Obsolete | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| 512M | |
| 64M | |
| 64Mx8 Flash + 8Mx8 DDR DRAM | |
| Yes | |
| 65nm | |
| -40 | |
| 105 | |
| Industrial Plus | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 1(Max) - 0.2(Min) mm |
| Package Width | 6 mm |
| Package Length | 8 mm |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 24 | |
| Lead Shape | Ball |
| EDA / CAD Models |
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