Infineon Technologies AGS25HS02GTDZBHM050Flash
2-Gb Flash with Quad SPI Interface Automotive AEC-Q100
| Compliant | |
| 3A991.b.1.a | |
| Active | |
| 8542.32.00.71 | |
| Automotive | Yes |
| PPAP | Yes |
| NOR | |
| 2G | |
| Sectored | |
| Yes | |
| Symmetrical | |
| Bottom|Top | |
| 256Kbyte x 1024 | |
| 256byte/512byte | |
| 1/2/4 | |
| 2G/1G/512M | |
| Yes | |
| Synchronous | |
| 8 | |
| 2762/Bulk | |
| 1.7/Page | |
| 45nm | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 1.7 to 2 | |
| 130 | |
| 66 | |
| -40 | |
| Yes | |
| Yes | |
| No | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 1.2(Max) - 0.2(Min) mm |
| Package Width | 8 mm |
| Package Length | 8 mm |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| 24 | |
| Lead Shape | Ball |
| EDA / CAD Models |
设计 AI 驱动的医疗设备
阅读 Arrow 白皮书，掌握系统设计技巧、器件推荐与 AI 洞察，助力高效、安全打造医疗方案。