California Eastern LaboratoriesRMLV0816BGBG-4S2#KC0SRAM 芯片
SRAM Chip Async Single 3V/3.3V 8M-bit 512K x 16 55ns 48-Pin TFBGA T/R
| Compliant | |
| 5A002 | |
| Active | |
| EA | |
| Automotive | No |
| PPAP | No |
| 8M | |
| 512K | |
| 16 | |
| 19 | |
| 1 | |
| Asynchronous | |
| 55 | |
| 2.4 | |
| 3|3.3 | |
| 3.6 | |
| 30 | |
| -40 | |
| 85 | |
| Tape and Reel | |
| Mounting | Surface Mount |
| Package Height | 0.8(Max) mm |
| Package Width | 7.5 mm |
| Package Length | 8.5 mm |
| PCB changed | 48 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| 48 | |
| Lead Shape | Ball |
设计 AI 驱动的医疗设备
阅读 Arrow 白皮书,掌握系统设计技巧、器件推荐与 AI 洞察,助力高效、安全打造医疗方案。

