Micron TechnologyMT44K64M18RB-093E:ADRAM 芯片
DRAM Chip RLDRAM3 1.125Gbit 64Mx18 1.35V 168-Pin BGA Tray
| Compliant | |
| EAR99 | |
| LTB | |
| 8542.32.00.36 | |
| Automotive | No |
| PPAP | No |
| RLDRAM3 | |
| 1.125G | |
| 64Mx18 | |
| 16 | |
| 4M | |
| 18 | |
| 18 | |
| 1200 | |
| 25 | |
| 1.28 | |
| 1.42 | |
| 0 | |
| 100 | |
| Commercial | |
| 18 | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 0.7(Min) mm |
| Package Width | 13.5 mm |
| Package Length | 13.5 mm |
| PCB changed | 168 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| 168 | |
| Lead Shape | Ball |
| EDA / CAD Models |
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