| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.39.00.90 |
| Automotive | No |
| PPAP | No |
| Type | SPI|I2C |
| Process Technology | 0.6um |
| Number of Channels per Chip | 4 |
| Maximum Data Rate | 150Mbps |
| Maximum Rise Time (ns) | 2(Typ) |
| Maximum Fall Time (ns) | 2(Typ) |
| Minimum Pulse Width (ns) | 6.67 |
| Maximum Pulse Width Distortion (ns) | 1 |
| Maximum Propagation Delay Skew (ns) | 7.9 |
| Output Type | Push-pull |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 1.71 |
| Maximum Propagation Delay Time (tPHL) (ns) | 14.9 |
| Minimum Isolation Voltage (Vrms) | 5000(Max) |
| Maximum Propagation Delay Time (tPLH) (ns) | 14 |
| Maximum Working Insulation Voltage | 848Vrms |
| Maximum Power Dissipation (mW) | 1126.8 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tube |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3|5 |
| Forward/Reverse Channels | 3/1 |
| Minimum Common Mode Rejection (kV/us) | 25(Typ) |
| Maximum ESD Protection Voltage (kV) | ±4(Typ)@HBM |
| Coupling Type | Capacitive Coupling |
| Mounting | Surface Mount |
| Package Height | 2.3 |
| Package Width | 7.5 |
| Package Length | 10.3 |
| PCB changed | 16 |
| Standard Package Name | SO |
| Supplier Package | SOIC W |
| Pin Count | 16 |
| Lead Shape | Gull-wing |
