| 欧盟RoHS指令 | Not Compliant |
| 美国出口管制分类ECCN编码 | 3A001.a.2.c. |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.31.00.60 |
| SVHC | Yes |
| SVHC超标 | Yes |
| Automotive | No |
| PPAP | No |
| Family Name | SmartFusion2 |
| Process Technology | 65nm |
| User I/Os | 267 |
| Number of I/O Banks | 8 |
| Operating Supply Voltage (V) | 1.2 |
| Logic Elements | 86184 |
| Number of Multipliers | 84 (18x18) |
| Program Memory Type | Flash |
| Embedded Memory (Kbit) | 2074 |
| Total Number of Block RAM | 109 |
| EMACs | 1 |
| SERDES Channels | 4 |
| Device Logic Units | 86184 |
| Device Number of DLLs/PLLs | 6 |
| PCIe | 2 |
| Programmability | Yes |
| Reprogrammability Support | No |
| Copy Protection | Yes |
| In-System Programmability | No |
| Speed Grade | 1 |
| Minimum Operating Supply Voltage (V) | 1.14 |
| Maximum Operating Supply Voltage (V) | 1.26 |
| I/O Voltage (V) | 1.5|1.8|2.5|3.3|1.2 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Temperature Grade | Military |
| Packaging | Tray |
| Tradename | SmartFusion |
| Mounting | Surface Mount |
| Package Height | 1.73 mm |
| Package Width | 23 mm |
| Package Length | 23 mm |
| PCB changed | 484 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 484 |
| Lead Shape | Ball |
