Syfer TechnologyLS1808N102J302NX080TM多层陶瓷电容器
Cap Ceramic Suppression Y3 0.001uF 3000VDC/250VAC C0G 5% Pad SMD 1808 125°C T/R
| Compliant with Exemption | |
| EAR99 | |
| NRND | |
| 8532.24.00.20 | |
| SVHC | Yes |
| SVHC超标 | Yes |
| Automotive | No |
| PPAP | No |
| 0.001uF | |
| 5% | |
| 3000VDC|250VAC | |
| C0G | |
| Standard | |
| No | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| Y3 | |
| 4.57 X 4.57 X 2.03 | |
| 1808 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 4.57 | |
| 4.57 | |
| 2.03(Max) |
| EDA / CAD Models |
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