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LIFCL407MG121C|LATTICE|simage
LIFCL407MG121C|LATTICE|limage
Field Programmable Gate Arrays - FPGAs

LIFCL-40-7MG121C

Embedded vision and processing FPGA based on the Lattice Nexus platform with class-leading power, small form factor, reliability, and performance.

Lattice Semiconductor
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Lattice CrossLink™-NX: Best-in-class Embedded Vision Processing FPGA

Built on the 28 nm FD-SOI Lattice Nexus™ platform, the CrossLink-NX family of FPGAs lead their class in power, small form factor, reliability, and performance. They are optimized to help developers create innovative embedded vision and AI solutions for communications, compute, industrial, automotive, and consumer systems.

Product Highlights

Applications: Lattice CrossLink-NX FPGAs are designed for embedded vision and processing applications including sensor and display bridging, sensor aggregation, sensor duplication, and AI inferencing at the Edge.







Benefits

Provides Best-in-class Performance for Vision Processing Applications  – High memory to logic cell ratio, up to 170 bits per logic cell, accelerates AI inferencing.

High Speed Interfaces –  2.5 Gbps Hardened MIPI D-PHY, 5 Gbps PCIe, 1.5 Gbps programmable I/O, 1066 Mbps DDR3. Supporting LVDS, subLVDS, OpenLDI (OLDI), and SGMII.

Built on Lattice Nexus platform –  Up to 75% lower power vs similar FPGAs and small form factor packaging with sizes as small as 4 mm x 4 mm.

Features

•  Instant-on configuration – I/O configures in 3 ms, and device as fast as 8 ms
•  FD-SOI programmable back bias enables per device performance / power optimization
•  Two hardened 4-lane MIPI D-PHY transceivers at 10 Gbps per PHY
•  Up to 37 programmable source synchronous I/O pairs for camera and display interfacing
•  From 4 mm x 4 mm WLCS package (0.4 mm pitch) to 17 mm x 17 mm BGA package (0.8 mm pitch)
•  Lowest soft error rate in its class, 100X more reliable than competition

Featured Content Section

Product Brief: MIPI Bridging and Edge AI Combined Into One FPGA

White Paper: Lattice Crosslink-NX: Embedded Vision Processing at the Edge

Lattice mVision Solutions Stack Accelerate Implementation of Low Power Embedded Vision Applications

Build FPGA-Based Processor Systems in Minutes

Product Brief: Predictable FPGA Design Convergence

Product Selector Guide: Ultra-Low Power Lattice sensAI™ Stack

Product Technical Specifications

Search Results

LIFCL-17
LIFCL-40

Related Searches

1. vision FPGA
2. FD-SOI
3. Lattice Nexus
4. edge computing
5. artificial intelligence
6. human presence
7. sensor

Related Product

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LIFCL-40-EVN  

CrossLink-NX Evaluation Board

LIF-MD6000-6UWG36ITR1K  

Crosslink Programmable Video Bridging Device

ICE40LP8K-CM81  

FPGA iCE40 LP Family 7680 Cells 40nm Technology 1.2V 81-Pin UCBGA Tray

LCMXO3LF-6900C-5BG400C2U  

FPGA MACHXO3 Family 6900 Cells 65nm Technology 1.2V Automotive 400-Pin CABGA Tray

LAE5UM-25F-6BG381E  

FPGA ECP5 Family 24000 Cells 40nm Technology 1.1V Automotive 381-Pin CABGA Tray

 

产品技术规范
  • 欧盟RoHS指令
    Compliant
  • 美国出口管制分类ECCN编码
    EAR99
  • 环保无铅
    Active
  • 美国海关商品代码
    8542.39.00.01
  • Automotive
    No
  • PPAP
    No
  • Family Name
    CrossLink-NX
  • Process Technology
    28nm
  • User I/Os
    48
  • Number of I/O Banks
    8
  • Operating Supply Voltage (V)
    1
  • Logic Elements
    39000
  • Number of Multipliers
    56 (18x18)
  • Program Memory Type
    SRAM
  • Embedded Memory (Kbit)
    1512
  • Total Number of Block RAM
    2
  • Maximum Distributed RAM Bits
    245760
  • Device Logic Units
    39000
  • Device Number of DLLs/PLLs
    3
  • Programmability
    Yes
  • Reprogrammability Support
    No
  • Copy Protection
    No
  • In-System Programmability
    No
  • Speed Grade
    7
  • Minimum Operating Supply Voltage (V)
    0.95
  • Maximum Operating Supply Voltage (V)
    1.05
  • I/O Voltage (V)
    1|1.2|1.35|1.5|1.8|2.5|3.3
  • Minimum Operating Temperature (°C)
    0
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Commercial
  • Tradename
    CrossLink™
  • Mounting
    Surface Mount
  • Package Height
    0.66
  • Package Width
    6
  • Package Length
    6
  • PCB changed
    121
  • Standard Package Name
    BGA
  • Supplier Package
    CSFBGA
  • Pin Count
    121

文档和资源

数据表
设计资源