Integrated Silicon Solution IncIS64LF12836A-7.5B3LA3SRAM 芯片
SRAM Chip Sync Quad 3.3V 4M-bit 128K x 36 7.5ns 165-Pin TEBGA Automotive AEC-Q100
| Compliant | |
| 3A991.b.2.a | |
| Active | |
| 8542.32.00.41 | |
| Automotive | Yes |
| PPAP | Yes |
| 4M | |
| 128K | |
| 36 | |
| Flow-Through | |
| SDR | |
| 17 | |
| 4 | |
| Synchronous | |
| 7.5 | |
| 117 | |
| 3.135 | |
| 3.3 | |
| 3.465 | |
| 175 | |
| -40 | |
| 125 | |
| Automotive | |
| Mounting | Surface Mount |
| Package Height | 0.79 mm |
| Package Width | 13 mm |
| Package Length | 15 mm |
| PCB changed | 165 |
| Standard Package Name | BGA |
| Supplier Package | TEBGA |
| 165 | |
| Lead Shape | Ball |
| EDA / CAD Models |
设计 AI 驱动的医疗设备
阅读 Arrow 白皮书，掌握系统设计技巧、器件推荐与 AI 洞察，助力高效、安全打造医疗方案。