| 欧盟RoHS指令 | Compliant with Exemption |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8541.10.00.80 |
| SVHC | Yes |
| SVHC超标 | Yes |
| Automotive | No |
| PPAP | No |
| 产品类别 | Power MOSFET |
| Configuration | Single |
| Channel Mode | Enhancement |
| Channel Type | N |
| Number of Elements per Chip | 1 |
| Maximum Drain-Source Voltage (V) | 500 |
| Maximum Gate-Source Voltage (V) | ±30 |
| Maximum Gate Threshold Voltage (V) | 4 |
| Operating Junction Temperature (°C) | -55 to 150 |
| Maximum Continuous Drain Current (A) | 8 |
| Maximum Gate-Source Leakage Current (nA) | 100 |
| Maximum IDSS (uA) | 25 |
| Maximum Drain-Source Resistance (mOhm) | 850@10V |
| Typical Gate Charge @ Vgs (nC) | 38(Max)@10V |
| Typical Gate Charge @ 10V (nC) | 38(Max) |
| Typical Gate to Drain Charge (nC) | 18(Max) |
| Typical Gate to Source Charge (nC) | 9(Max) |
| Typical Reverse Recovery Charge (nC) | 2000 |
| Typical Input Capacitance @ Vds (pF) | 1018@25V |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 8@25V |
| Minimum Gate Threshold Voltage (V) | 2 |
| Typical Output Capacitance (pF) | 155 |
| Maximum Power Dissipation (mW) | 3100 |
| Typical Fall Time (ns) | 19 |
| Typical Rise Time (ns) | 23 |
| Typical Turn-Off Delay Time (ns) | 26 |
| Typical Turn-On Delay Time (ns) | 11 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 150 |
| Maximum Pulsed Drain Current @ TC=25°C (A) | 32 |
| Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 40 |
| Typical Gate Plateau Voltage (V) | 5.25 |
| Typical Reverse Recovery Time (ns) | 422 |
| Maximum Diode Forward Voltage (V) | 2 |
| Minimum Gate Resistance (Ohm) | 0.7 |
| Maximum Gate Resistance (Ohm) | 3.7 |
| Maximum Positive Gate-Source Voltage (V) | 30 |
| Mounting | Surface Mount |
| Package Height | 4.45 |
| Package Width | 9.02 |
| Package Length | 10.16 |
| PCB changed | 2 |
| Tab | Tab |
| Standard Package Name | TO |
| Supplier Package | D2PAK |
| Pin Count | 3 |
