| Compliant | |
| EAR99 | |
| Active | |
| 8542.33.00.01 | |
| Automotive | No |
| PPAP | No |
| Driver Amplifier | |
| 1 | |
| 20000 | |
| 18500 | |
| 11.5@20000MHz | |
| 14@20000MHz | |
| 10(Typ)@20000MHz | |
| 10(Typ)@20000MHz | |
| 8 | |
| 5 | |
| 75(Typ)@8V | |
| Single | |
| 1350 | |
| -40 | |
| 85 | |
| Tape and Reel | |
| Mounting | Surface Mount |
| Package Height | 0.88 mm |
| Package Width | 5 mm |
| Package Length | 5 mm |
| PCB changed | 32 |
| Standard Package Name | CSP |
| Supplier Package | LFCSP EP |
| 32 | |
| Lead Shape | No Lead |
Receiving a weak signal? Amplify it with this general purpose amplifier HMC871LC5 buffer amplifier from Analog Devices, for a better signal. Its maximum power dissipation is 1350 mW. This RF amplifier chip has a minimum operating temperature of -40 °C and a maximum of 85 °C. Tape and reel packaging will encase the product during shipment, ensuring safe delivery and enabling quick mounting of components. It has a single channel per chip. This device uses a single power supply.
| EDA / CAD Models |
设计 AI 驱动的医疗设备
阅读 Arrow 白皮书，掌握系统设计技巧、器件推荐与 AI 洞察，助力高效、安全打造医疗方案。