| Compliant | |
| EAR99 | |
| LTB | |
| 8542.33.00.01 | |
| Automotive | No |
| PPAP | No |
| Power Amplifier | |
| 1 | |
| 2200 | |
| 9@2170MHz | |
| 31@2170MHz | |
| 53 | |
| 48@2170MHz | |
| 11(Typ)@2170MHz | |
| 20(Typ)@2170MHz | |
| 7.5@2170MHz | |
| 6 | |
| 5 | |
| 485(Typ)@5V | |
| Single | |
| 2700 | |
| -40 | |
| 85 | |
| Tape and Reel | |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) mm |
| Package Width | 4(Max) mm |
| Package Length | 5(Max) mm |
| PCB changed | 16 |
| Standard Package Name | SO |
| Supplier Package | QSOP |
| 16 | |
| Lead Shape | Gull-wing |
This power amplifier HMC452QS16GE buffer amplifier, developed by Analog Devices, will adjust an RF signal to meet your project's specifications. Its maximum power dissipation is 2700 mW. This RF amplifier chip has a minimum operating temperature of -40 °C and a maximum of 85 °C. In order to ensure safe delivery and enable quick mounting of this component after delivery, it will be encased in tape and reel packaging during shipment. It has a single channel per chip. This device uses a single power supply.
| EDA / CAD Models |
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