VishayGA1206H563MBABT31G多层陶瓷电容器
Cap Ceramic 0.056uF 50V X8R 20% Pad SMD 1206 Polymer Termination 150°C Automotive AEC-Q200 T/R
| Compliant | |
| EAR99 | |
| Active | |
| EA | |
| Automotive | Yes |
| PPAP | Yes |
| 0.056uF | |
| 20% | |
| 50VDC | |
| X8R | |
| Polymer Termination | |
| No | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 2.5 | |
| 3.2 X 1.6 X 1.7 | |
| 1206 | |
| -55 | |
| 150 | |
| Tape and Reel | |
| 3.2 | |
| 1.6 | |
| 1.7(Max) |
| EDA / CAD Models |
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