Infineon Technologies AGDS42694Multi-Chip Package Memory
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM AM29DL324D Bottom Boot 32 Megabit (4 M X 8-Bit/2 M X 16-Bit) CMOS 3.0 Volt-Only, Simultaneous Operation Flash Memory and 4 Mbit (512 K X 8-Bit/ 256 K X 16-Bit) Static Ram
| Supplier Unconfirmed | |
| EAR99 | |
| Obsolete | |
| 8542.32.00.71 | |
| Automotive | Unknown |
| PPAP | Unknown |
| EDA / CAD Models |
设计 AI 驱动的医疗设备
阅读 Arrow 白皮书，掌握系统设计技巧、器件推荐与 AI 洞察，助力高效、安全打造医疗方案。