Infineon Technologies AGCYW20707UA1KFFB1G蓝牙
Bluetooth SoC for Embedded Wireless Devices
| Compliant | |
| 5A992.c | |
| 8542.31.00.70 | |
| Automotive | No |
| PPAP | No |
| Chip | |
| Bluetooth v4.1 (BR/EDR/LE) | |
| Class I/Class II | |
| 12 | |
| 2402 | |
| 2480 | |
| ISM | |
| 2.4GHz | |
| -96.5 | |
| GPIO/HCI/I2C/I2S/PCM/SPI/UART | |
| 3 | |
| 3.3 | |
| 3.6 | |
| -30 | |
| 85 | |
| Mounting | Surface Mount |
| Package Height | 0.86(Max) mm |
| Package Width | 4 mm |
| Package Length | 4.5 mm |
| PCB changed | 49 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 49 |
| EDA / CAD Models |
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