Infineon Technologies AGCY7C1663KV18-550BZXCSRAM 芯片
SRAM Chip Sync Dual 1.8V 144M-bit 8M x 18 0.45ns 165-Pin FBGA Tray
| Compliant | |
| 3A991b.2.a. | |
| Active | |
| 8542.32.00.41 | |
| Automotive | No |
| PPAP | No |
| 144M | |
| 8M | |
| 18 | |
| Pipelined | |
| QDR | |
| 21 | |
| 2 | |
| Synchronous | |
| 0.45 | |
| 550 | |
| 1.7 | |
| 1.8 | |
| 1.9 | |
| 1090 | |
| 0 | |
| 70 | |
| Commercial | |
| Tray | |
| Mounting | Surface Mount |
| Package Height | 0.89 mm |
| Package Width | 15 mm |
| Package Length | 17 mm |
| PCB changed | 165 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 165 | |
| Lead Shape | Ball |
| EDA / CAD Models |
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